Flexible printed circuit board (FPCB) micro leveling mechanism and FPCB micro leveler

Abstract

The invention discloses and provides a flexible printed circuit board (FPCB) micro leveling mechanism being reasonable in design and simple in mechanism and capable of increasing the enterprise product yield and effectively lowering the enterprise production consumption, and an FPCB micro leveler comprising the FPCB micro leveling mechanism. The FPCB micro leveling mechanism comprises pneumatic positioning modules, a mounting plate and micro leveling modules, wherein the pneumatic positioning modules are arranged above the mounting plate; the micro leveling modules are arranged below the mounting plate; and the micro leveling modules pass through the mounting plate, and correspond to the pneumatic positioning modules. The FPCB micro leveler comprises a base, wherein the FPCB micro leveling mechanism is fixedly arranged on the base; a charging tray conveying frame, a product positioning fixture and a feeder are also arranged on the base; the product positioning fixture is arranged on one side of a conveying terminal of the charging tray conveying frame; one side of the charging tray conveying frame corresponds to the product positioning fixture; and the other side of the charging tray conveying frame corresponds to the FPCB micro leveling mechanism. The FPCB micro leveling mechanism and the FPCB micro leveler are suitable for the field of FPCB substrate micro leveling.

Description

Technical field [0001] The invention relates to an FPCB board micro-leveling mechanism and an FPCB board micro-leveling machine. Background technique [0002] Among FPCB products, one product is an ultra-thin FR-type FPCB circuit board. This board is a substrate, which is mainly used for the entire circuit packaging of certain micro ICs and components. The production port size is 4×4mm to 12×12mm. The substrate must ensure a certain degree of flatness before packaging the components, otherwise the correct position cannot be guaranteed when the components are mounted. However, in the production process of this product, due to the influence of technical conditions or external conditions, it is inevitable that products with substandard surface flatness will be produced. According to the current production workshops of most enterprises, the substrate can only be obtained by measurement for such substandard products. The flatness cannot be leveled manually. When this product is found...

AI Technical Summary

Problems solved by technology

[0002] Among the FPCB products, there is a product that is an ultra-thin FR type FPCB circuit board. This board is a substrate and is mainly used for the entire circuit packaging of certain micro ICs and components. The size of the output port is 4×4mm to 12×12mm. The substrate must ensure a certain degree of flatness before packaging the components, otherwise the correct position cannot be guaranteed when the components are mounted

However, in the process of producing this product, due to the influence of technical conditions or external conditions, it is inevitable that there will be products whose surface flatness does not meet the standard. According to the current situation in the production workshops of most enterprises, the substrate for this substandard product can only be obtained through measurement. The flatness cannot be leveled manually. When such a product is found, only a little correction can be made or it will be scrapped directly; or some enterprises directly correct it manually by clamping, pressing or pulling, but because the substrate itself is FR4 circuit board material is very thin, its thickness is 0.2-0.4mm, relatively speaking, it is relatively brittle, so in the process of manual shaping, this method is not only time-consuming and laborious, but also cannot guarantee that most products will be obtained through manual shaping. Correction, and it is also possible to directly damage the substrate and cause more scrap, resulting in low production efficiency and high cost of waste

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