Wiring board assembly and manufacturing method thereof
A technology for wiring boards and assemblies, applied in the direction of electrical connection of printed components, printed circuit components, electrical components, etc., can solve problems such as poor productivity, and achieve the effects of improving productivity, improving connection reliability, and expanding area
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no. 1 approach
[0033] like figure 1 As shown, the wiring board assembly 1 of this embodiment is provided with the flexible printed wiring board 2, the metal reinforcement board 3 attached to this flexible printed wiring board 2, and the solder connection part 4.
[0034] The flexible printed wiring board 2 includes an insulating substrate 5 , a first wiring pattern 61 and a second wiring pattern 62 provided on the insulating substrate 5 , and a first covering layer 71 and a second covering layer 72 . In addition, if figure 2 (A), figure 2 As shown in (B), either the first wiring pattern 61 or the second wiring pattern 62 may be omitted.
[0035] The insulating substrate 5 is composed of a flexible insulating substrate, and examples of materials constituting such a substrate include polyimide, polyethylene terephthalate, polyethylene naphthalate, and the like. .
[0036] like figure 1As shown, the insulating substrate 5 of this embodiment is provided with a through-hole 53 penetrating ...
no. 2 approach
[0078] Image 6 (A) and Image 6 (B) is a diagram showing a wiring board assembly according to a second embodiment of the present invention, wherein Image 6 (A) is a plan view, Image 6 (B) is along Image 6 (A) Cross-sectional view of line VIB-VIB.
[0079] like Image 6 (A) and Image 6 As shown in (B), the wiring board assembly 1B of this embodiment is provided with the flexible printed wiring board 2B, the metal reinforcement board 3 attached to this flexible printed wiring board 2B, the solder connection part 4, and the communication path 8.
[0080] This embodiment differs from the first embodiment in that one communication passage 8 is provided in the wiring board assembly 1B and that one second through-hole 55 is provided in the insulating substrate 5B.
[0081] In addition, since the metal reinforcement plate 3 and the solder connection part 4 which comprise the wiring board assembly 1B in 2nd Embodiment are the same as each structure included in the wiring boa...
no. 3 approach
[0117] This embodiment differs from the first embodiment in that the insulating substrate is provided with a plurality of (two in this example) through-holes, but is the same as the first embodiment except for that. Hereinafter, only the parts different from the first embodiment will be described, and the same parts as the first embodiment will be given the same reference numerals, and the description will be omitted.
[0118] like Figure 9 (A) and Figure 9 As shown in (B), first through-hole 53A and second through-hole 53B are provided in insulating substrate 5C of flexible printed wiring board 2C constituting wiring board assembly 1C of this embodiment. In addition, the insulating substrate 5C has the same structure as the insulating substrate 5 described in the first embodiment except for the number of through holes provided.
[0119] The first and second through holes 53A, 53B are along the vertical direction ( Figure 9 (A) and Figure 9 (B) Z direction) formation. ...
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