Adsorption component and preparation method of adsorption component

Abstract

The invention discloses an adsorption component, comprising a bottom and a plurality of adsorption units arranged on the bottom; each adsorption unit comprises a connecting surface and an adsorption surface, which are arranged away from each other in an axial direction of the adsorption unit; each connecting surface is connected to the bottom; and each adsorption surface is a circular-arc-shaped surface and sunk towards the bottom. The adsorption component provided by the embodiment of the present invention comprises the bottom and the plurality of adsorption units arranged on the bottom; each adsorption unit is provided with the circular-arc-shaped adsorption surface that is capable of detachably adsorbing an external component, and the bottom can be fixedly connected to another external component; in other words, the adsorption component is capable of detachably attaching one external component to another external component, and enabling an adsorption and sticking effect to be optimum; in addition, detaching is also facilitated better. The invention also provides a preparation method of the adsorption component.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to an absorber and a method for preparing the absorber. Background technique [0002] The lamination of the screen and the shell in the existing intelligent terminal generally adopts the following processes: glue dispensing process, foam glue laminating process, or foam glue + partial glue dispensing process. The inventor found the following problems when implementing the above process to attach the screen to the upper casing: (1), due to the different dispensing paths of the dispensing process, it is necessary to be equipped with a dispensing machine, which is costly and prone to overflowing glue, which affects At the same time, it needs to wait until the glue is condensed to have a better laminating effect, so it needs a long time to hold the pressure, which affects the production efficiency; It will lose its activity, leading to problems such as viscosity drop and screen glue...

AI Technical Summary

Problems solved by technology

The inventor found the following problems when implementing the above process to attach the screen to the upper casing: (1), due to the different dispensing paths of the dispensing process, it is necessary to be equipped with a dispensing machine, which is costly and prone to overflowing glue, which affects At the same time, it needs to wait until the glue is condensed to have a better bonding effect, so it needs a long time to hold the pressure, which affects the production efficiency; (2), the foam glue bonding process is difficult due to the viscosity of foam glue It will lose its activity, leading to problems such as viscosity drop and screen glue opening; (3), whether it is dispensing process, foam glue bonding process, or foam glue + local dispensing process, after disassembling the screen relative to the shell , are not reusable, need to clean the bonding parts, before the next bonding

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