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Compression-joint type power device thermal resistance testing and detecting device

A technology for testing and testing power devices, applied in the field of thermal resistance testing and testing devices for crimping power devices, which can solve the problems of low accuracy, inability to meet the requirements at the same time, and a small range of applied pressure, achieve precise and stable pressure, and reduce stress The effect of uniformity and wide pressure range

Inactive Publication Date: 2016-05-04
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the device realizes the downward conduction of heat along the one-dimensional direction, it still has small pressure range, low precision, poor uniformity and poor portability, and it cannot satisfy the traditional thermocouple test method and the transient thermal interface method at the same time, and The thermal resistance test of single-sided and double-sided heat dissipation of press-fit power devices cannot be realized at the same time

Method used

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  • Compression-joint type power device thermal resistance testing and detecting device
  • Compression-joint type power device thermal resistance testing and detecting device
  • Compression-joint type power device thermal resistance testing and detecting device

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Embodiment Construction

[0034] In order to better understand the present invention, the content of the present invention will be further described below with reference to the accompanying drawings and examples in the specification.

[0035] The invention provides a crimping type power device thermal resistance test and detection device, which includes a frame composed of a vertical column (21) with horizontal components arranged in a vertical direction, and the vertical column is provided with a height adjusting member and a limiting member.

[0036] The height adjusting member includes a middle base plate (12) arranged in the middle of the upright column (21) and a pressure maintaining plate (3) in the middle and lower part of the upright column (21), and the limiting member is arranged on the upright column ( 21) on the nut (22). The horizontal component includes an upper substrate (11), a middle substrate (12), a lower substrate (13) and a pressure maintaining substrate (3), and the horizontal componen...

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Abstract

The invention provides a compression-joint type power device thermal resistance testing and detecting device. The thermal resistance testing and detecting device comprises a frame formed by arranging members in the horizontal direction on stand columns (21) in the vertical direction. The stand columns are provided with height adjusting parts and limiting parts. As a hydraulic pump is adopted for applying pressure, compared with a traditional rotating threaded rod for applying pressure, the thermal resistance testing and detecting device is large in adjustable range, high in precision and good in uniformity, has good transportability, and can meet the requirements of a traditional thermocouple measuring method and a transient heat interface method; moreover, thermal resistance testing in the single-face and double-face heat dissipating process of a compression-joint type power device can be achieved, and the device is very suitable for thermal resistance testing of the compression-joint type power device.

Description

Technical field [0001] The invention relates to the field of semiconductor device testing, in particular to a crimping type power device thermal resistance testing device. Background technique [0002] Crimp-type power devices, such as crimp-type IGBTs (insulated gate bipolar transistors), are widely used in the fields of industry, information, new energy, medicine, transportation, military and aviation. They have high reliability and are easy to connect in series. , And show a short-circuit failure mode when the device is damaged, so it is particularly suitable for high-voltage and high-power fields such as smart grids. [0003] The thermal resistance of a semiconductor device is currently the only standard to measure the heat dissipation performance of a semiconductor device, and it is also one of the most important parameters of a semiconductor device. The size of the thermal resistance of the device largely limits the improvement of the power density of the semiconductor device...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 张朋邓二平刘文广
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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