Solar cell containing P-type semiconductor electrode and fabrication method of solar cell
A technology of solar cells and semiconductors, applied in the field of solar cells, can solve the problems of reducing the area of incident light, difficult to industrialize, complicated preparation process, etc., and achieve the effects of reducing reflection, reducing internal resistance, and simple preparation method
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[0033] The present invention also provides a method for preparing a solar cell, the method comprising: combining the negative electrode, the PN junction silicon chip, and the positive electrode sequentially from the light-receiving surface to the backlight surface to obtain a solar cell; the negative electrode includes a P-type solar cell on the light-receiving surface The semiconductor sheet and the silver electrode sheet on the backlight surface, the P-type semiconductor sheet and the silver electrode sheet are both connected to the light-receiving surface of the PN junction silicon sheet.
[0034] According to the present invention, in order to reduce the reflection of incident light and the internal resistance of solar energy, the light-receiving surface of the PN junction silicon wafer preferably also includes an anti-reflection film, and the anti-reflection film can be silicon nitride and / or titanium oxide anti-reflection film , the backlight surface of the PN junction si...
Embodiment 1
[0040] Such as figure 1 As shown, a 5 cm × 5 cm phosphorus-doped silicon wafer is subjected to boron diffusion to obtain a boron-diffused phosphorus-doped silicon wafer. The P pole of the boron-diffused phosphorus doped silicon wafer is coated with a silicon nitride anti-reflection film, and the N pole is coated with silver. back field.
[0041] Overlap the 2.5cm×2cm P-type semiconductor sheet and the 2.5cm×2cm silver electrode sheet, then place one end in the middle of the anti-reflection film and weld it, and the other end protrudes 0.5cm from the silicon chip, using a 0.1cm×0.2cm P-type semiconductor The small piece connects the P-type semiconductor piece with the anti-reflection film.
[0042] The copper sheet is spot-welded on the silver back field as the negative electrode to obtain the solar cell of the present invention.
Embodiment 2
[0044] Such as figure 1 As shown, a 5 cm × 5 cm phosphorus-doped silicon wafer is subjected to boron diffusion to obtain a boron-diffused phosphorus-doped silicon wafer. The P pole of the boron-diffused phosphorus doped silicon wafer is coated with a titanium oxide anti-reflection film, and the N pole is coated with a silver back. field.
[0045] Overlap the 2.5cm×2cm P-type semiconductor sheet and the 2.5cm×2cm silver electrode sheet, then place one end in the middle of the anti-reflection film and weld it, and the other end protrudes 0.5cm from the silicon chip, using a 0.1cm×0.2cm P-type semiconductor The small piece connects the P-type semiconductor piece with the anti-reflection film.
[0046] The copper sheet is spot-welded on the silver back field as the negative electrode to obtain the solar cell of the present invention.
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