A method of manufacturing a circuit board
A manufacturing method and circuit board technology, applied in the direction of multilayer circuit manufacturing, etc., can solve the problems of increasing manufacturing costs, affecting the yield of circuit boards, and clamping dry films, so as to save manufacturing costs and improve the production yield.
Active Publication Date: 2018-10-26
SHENNAN CIRCUITS
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Problems solved by technology
[0005] However, when making circuit patterns on the metal layer, since there is a thickness difference between the thickness of the metal layer in the thickened region and the metal in the non-thickened region, if the thickness difference is greater than the thickness of the dry film, then in the process of making circuit patterns There will be a dry film phenomenon, which will affect the production yield of the circuit board and increase the manufacturing cost
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[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0041] see figure 1 , an embodiment of a method for manufacturing a circuit board in an embodiment of the present invention includes:
[0042] 101. Making the first circuit graphics in the first part;
[0043] The circuit board includes a metal layer arranged on the substrate, the metal layer includes a first part and a second part, the metal layer is covered with a first dry film, and the position corresponding to the first part on the first dry film has a pattern correspond...
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An embodiment of the invention discloses a method for manufacturing a circuit board in order to prevent the phenomenon of film clamping in the process of circuit pattern manufacture on a circuit board, improve the production yield of circuit boards and lower the manufacture cost. The circuit board comprises a metal layer arranged on a substrate, and the metal layer includes a first part and a second part. The method disclosed by the embodiment of the invention comprises the following steps: covering the metal layer with a first dry film, and making a first circuit pattern on the first part; covering the first circuit pattern and the second part with an insulating layer, wherein the insulating layer includes a third part covering the first circuit pattern and a fourth part covering the second part; removing the fourth part, and thinning the second part to a preset thickness; and making a second circuit pattern on the second part which is thinned to the preset thickness.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a circuit board Background technique [0002] Printed circuit board (English: Printed Circuit Board, PCB, referred to as: PCB), is one of the important components of the electronics industry, almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronic equipment, military weapons System, as long as there are electronic components such as integrated circuits, for the electrical interconnection between them, printed boards must be used. [0003] In order to realize the electrical connection of the circuit board, a conductive circuit is formed on the circuit board. Since the current flowing through the conductive circuit is different in practical applications, in the local area where a large current needs to flow, the circuit on the circuit board should be in the local area. ...
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IPC IPC(8): H05K3/46
Inventor 郭长峰张学平罗斌
Owner SHENNAN CIRCUITS