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A method for making back-drilled holes with solder resist ink half-plugged holes

A technology of solder resist ink and production method, which is applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problem of inability to make solder resist ink plug holes and back drill holes, and achieve the effect of reducing the scrap rate

Active Publication Date: 2018-04-03
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problem that the existing method cannot make back-drilled holes with solder resist ink plug holes at one end and no solder resist ink plug holes at the other end, and provides a method for making back drill holes with solder resist ink half-plugged holes

Method used

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Examples

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Effect test

Embodiment

[0019] The present embodiment provides a method for making a PCB, especially making a backdrilled hole with solder resist ink half-plugged on the PCB, that is, one end of the back drilled hole (with copper on the hole wall) is filled with solder resist ink and the other end (the hole wall No Copper) No solder mask ink fill.

[0020] The specific production steps are as follows:

[0021] (1) outer line

[0022] According to the prior art, the inner layer circuit pattern on the film is transferred to the inner core board through the negative film process, and after etching and defilming treatment, the inner layer circuit is formed on the inner core board. spare.

[0023] Then, the inner layer core board and the outer layer copper foil are pressed together through the prepreg to form a multilayer board.

[0024] Next, according to the prior art, the multilayer board is sequentially subjected to drilling, copper sinking and full-board electroplating treatment to metallize the d...

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Abstract

The invention relates to the technical field of circuit board production, and particularly provides a manufacturing method of a back-drilling hole of a solder resist ink half-plug hole. The sequence of the original process flow is changed, and a solder resist layer is manufactured on a multilayer board and then back-drilling is performed so that the problems that the back-drilling hole is not fully filled with solder resist ink can be solved, the problems of influence on the appearance of a PCB or skip plating in subsequent surface treatment caused by pollution to the solder resist surface due to hidden potion in the unfilled position of the solder resist ink plug hole can be avoided, and thus rejection rate of the product can be reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for making back-drilled holes half-plugged with solder resist ink. Background technique [0002] With the continuous advancement of modern communication technology, the PCB used as a communication base station continues to develop in the direction of high multi-layer, high thickness and large size. Since this type of PCB is a ≥16-layer high-layer circuit board, in order to transmit signals at high speed and meet impedance matching and other issues, it is necessary to achieve mutual conduction between different layers, and this type of high-layer board has a high number of layers. The thickness of the board is thick, so it is impossible to make metallized blind holes by laser blind holes and electroplating hole filling methods. However, with the advancement of CNC drilling technology, the back drilling process that can control the depth can well meet this...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/46H05K2203/1438
Inventor 白亚旭张国城赵波
Owner SHENZHEN SUNTAK MULTILAYER PCB
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