A polishing device for smt laser template

Abstract

The invention discloses a polishing device for a surface mounting technology (SMT) laser template. The polishing device comprises a shell, a first partition plate, a second partition plate and a liquid supplying unit, wherein the shell is provided with a hollow cavity, and an opening is formed in one side of the shell; the first partition plate and the second partition plate are installed in the shell and used for supporting laser template units; and the liquid supplying unit is installed at the top of the shell and used for delivering polishing liquid to the laser template units. Each laser template unit comprises a laser template body provided with a plurality of through holes and a sponge sleeve arranged on the laser template body in a sleeving mode. The first partition plate and the second partition plate are distributed in the height direction of the shell, and the second partition plate is located under the first partition plate. Through hole parts corresponding to the multiple through holes of the laser template bodies are formed in the first partition plate and the top end face and the bottom end face of each sponge sleeve correspondingly. By the adoption of the polishing device, the use amount of the polishing liquid can be effectively reduced, and the production cost is reduced.

Description

Technical field: [0001] The invention relates to the technical field of polishing equipment, in particular to a polishing device for SMT laser templates. Background technique: [0002] Surface mount technology (SMT) is currently the mainstream technology for electronic product manufacturing. Printing stencils are required before the electronic component placement process. The printing stencils are produced by chemical etching and laser cutting. Laser-cut stencils are usually called SMT laser stencils, which have the characteristics of high position accuracy, but there are certain burrs and roughness on the outer surface and hole wall after cutting, which will affect the effect of printing solder paste. Since SMT laser templates are generally thinner and their holes are smaller, common methods of deburring and polishing, such as mechanical grinding, are not applicable. The existing method of polishing SMT laser templates generally adopts the chemical immersion method. Durin...

AI Technical Summary

Problems solved by technology

The existing method of polishing SMT laser templates generally adopts the chemical immersion method. During the polishing process, it is only necessary to inject the polishing solution into the container, and then pour the laser template to be polished into the polishing solution. The polishing process is relatively simple. However, its disadvantages are: during the polishing process, a large amount of polishing liquid needs to be injected into the container to submerge the laser template, and the amount of polishing liquid used is relatively large, which increases the production cost

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