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Camera Module and Endoscope Unit

A technology of camera module and solid-state camera element, applied in the fields of endoscopy, medical science, surgery, etc., can solve problems such as image noise and driving signal interference, and achieve the effect of reducing interference and preventing noise

Active Publication Date: 2018-06-19
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the imaging unit, the image signal output from the imaging element is output to the image signal cable via the buffer chip, and the driving signal is input to the imaging element from the driving signal cable. The distance between the transmission path of the driving signal and the transmission path of the image signal is close, so there may be a problem that the driving signal interferes with the image signal and generates noise in the image

Method used

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  • Camera Module and Endoscope Unit
  • Camera Module and Endoscope Unit
  • Camera Module and Endoscope Unit

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0041] figure 1 It is a diagram schematically showing the overall configuration of the endoscope system according to Embodiment 1 of the present invention. like figure 1 As shown, the endoscope device 1 has an endoscope 2 , a universal cable 6 , a connector 7 , a light source device 9 , a processor (control device) 10 , and a display device 13 .

[0042] The endoscope 2 captures in-vivo images of the subject by inserting the insertion unit 4 into the body cavity of the subject, and outputs imaging signals. The cable bundle inside the universal cable 6 extends to the distal end of the insertion portion 4 of the endoscope 2 and is connected to the imaging device provided at the distal end portion 31 of the insertion portion 4 .

[0043] The connector 7 is provided at the base end of the universal cable 6, is connected to the light source device 9 and the processor 10, performs predetermined signal processing on the imaging signal output from the imaging device at the front end...

Embodiment approach 2

[0076] The camera module according to the second embodiment differs from the first embodiment in that the drive signal cable 48A, the image signal cable 48B, and the power supply cable 48C are connected to the multilayer substrate 46 . Figure 9 This is a plan view of the camera module according to Embodiment 2 viewed from above in the stacking direction. Figure 10 is along Figure 9 The cross-sectional view taken along line C-C is a cross-sectional view when the imaging module is cut along a plane perpendicular to the substrate 45 and parallel to the optical axis direction of the solid-state imaging device 44 .

[0077] In the camera module 40B of Embodiment 2, as Figure 10 As indicated by the solid line in , the image signal is transmitted to the image signal cable 48B in the same manner as in the first embodiment. On the other hand, if Figure 10 As shown by the dotted line in , the drive signal input from the drive signal cable 48A is transmitted to the drive signal w...

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Abstract

To provide a camera module and an endoscope device that can obtain high-quality images and realize miniaturization of the tip of an insertion portion. The imaging module (40) of the present invention is characterized in that the imaging module (40) has a solid-state imaging element (44), a substrate (45) extending in the direction of the optical axis of the solid-state imaging element (44), and a substrate (45) formed on the substrate (45). ) and the laminated substrate (46) on which electronic components (55-58) are mounted, the electronic components (57 and 58) are embedded in the laminated substrate (46), and the transmission path of the image signal and the transmission path of the drive signal are buried The electronic components (57 and 58) in the laminated substrate (46) are branched at the position close to the solid-state imaging element (44), so that the image signal and the driving signal are transmitted through different layers of the substrate (45) and the laminated substrate (46). send.

Description

technical field [0001] The present invention relates to an imaging module and an endoscope device that are installed at the tip of an insertion portion of an endoscope inserted into a subject, and image an inside of a subject. Background technique [0002] Conventionally, endoscope devices have been widely used in various inspections in the medical and industrial fields. Among them, in a medical endoscope apparatus, by inserting an elongated flexible insertion portion provided with an imaging element at the tip into the body cavity of a subject such as a patient, the subject can be It is widely used to obtain in-vivo images of the body cavity and to protrude a treatment tool from the tip of the insertion part to perform treatment as needed. [0003] An imaging unit is embedded in the front end of the insertion portion of such an endoscope device, and the imaging unit includes an imaging element and a circuit board on which electronic components such as a capacitor or an IC ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B1/04A61B1/00
CPCA61B1/0008A61B1/00114A61B1/051A61B1/05A61B1/00096A61B1/0676A61B1/00018
Inventor 五十岚考俊
Owner OLYMPUS CORP