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Flexible circuit board

A flexible circuit board and flexible substrate technology, applied in the electronic field, can solve the problems of increased signal transmission delay, impedance difference, and different areas of the ground wire 11 of the reference layer, etc.

Active Publication Date: 2016-05-25
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

from figure 1 It can be seen from the figure that since the positions of the signal line 121 and the signal line 122 relative to the reference layer ground line 11 are inconsistent, their areas relative to the reference layer ground line 11 are also different, which will result in two signal lines 121 There is an impedance difference between 122 and 122, which will increase the transmission delay of the signal on the differential signal line pair 12, and affect the stability of high-speed signal transmission

Method used

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[0011] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0012] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0013] Please refer to Figure 2A and Figure 2B , which shows a schematic structural diagram of an embodiment of the flexible circuit board of the present application. Figure 2A is a top view of the flexible circuit board 20 of this embodiment, Figure 2B yes Figure 2...

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Abstract

The embodiment of the invention discloses a flexible circuit board, which comprises a first metal layer, a second metal layer and a flexible substrate, wherein the flexible substrate is arranged between the first metal layer and the second metal layer; at least one pair of differential signal lines is arranged in the first metal layer; a plurality of hollowed-out patterns are arranged in the second metal layer; each hollowed-out pattern at least comprises opposite and parallel two sides; and only the opposite and parallel two sides are intersected with one pair of differential signal lines in one hollowed-out pattern. The flexible circuit board can reduce the impedance difference between the differential signal lines.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to the field of circuit technology, and in particular to a flexible circuit board. Background technique [0002] Flexible printed circuit board (FlexiblePrintedCircuitboard, FPC) is a printed circuit made of flexible insulating substrates. It has the advantages of high wiring density, light weight, thin thickness, and good bendability, so it has a wide range of applications in the electrical field. A multi-layer FPC may include a signal layer for transmitting signals and a reference ground for a reference plane, and a pair of differential signal lines may be provided in the signal layer for transmitting high-speed signals. [0003] In the prior art, although differential signal lines can improve the anti-interference ability of signal transmission to a certain extent and precisely control signal timing, it is difficult to evenly arrange the differential signal lines on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0228
Inventor 陈珑周会娟谭绿水戴超
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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