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A method for non-destructive testing of film adhesion based on cohesion model

A technology for film adhesion and non-destructive testing, applied in measurement devices, instruments, and mechanical devices, etc., can solve problems such as film damage and insufficient reliability margins of measurement results, and achieve a clear and clear process of measurement and parameter determination. easy-to-finish effects

Inactive Publication Date: 2018-10-16
TIANJIN UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, these methods will cause damage to the film, and the reliability margin of the measurement results is not sufficient

Method used

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  • A method for non-destructive testing of film adhesion based on cohesion model
  • A method for non-destructive testing of film adhesion based on cohesion model
  • A method for non-destructive testing of film adhesion based on cohesion model

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Embodiment Construction

[0025] The method of the present invention will be described in detail below.

[0026] 1) The adhesion between the film and the substrate can be expressed by the relationship between the adhesion force between the interface and the relative displacement of the interface, and the adhesion force between the interface changes with the relative distance of the material interface, This functional relationship can be described by a cohesion model. The potential function of the exponential cohesion model proposed by Xu and Needleman is used to express this relationship:

[0027]

[0028] Among them, Δ n is the normal interface splitting distance, Δ t is the splitting distance of the tangential interface, σ max is the maximum stress normal to the interface, δ n is the normal characteristic length, corresponding to the maximum value of the normal interface stress σ max The splitting distance of the time interface, is the tangential characteristic length, corresponding to the ...

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Abstract

The invention relates to a nondestructive testing method for the adhesion of a thin film based on a cohesion model. The nondestructive testing method comprises the following steps: representing the adhesion between the thin film and a substrate by using a relation of an adhesion force between interfaces and an interface relative displacement; establishing a potential function of an index type cohesion model to represent an adhering condition between the thin film and the substrate; utilizing the index type cohesion model as a constitutive model of a thin film substrate interface unit in a thin film substrate structure and establishing a finite element model considering the interface adhesion, wherein the model includes two parts including the thin film and the substrate, and a cohesion unit is added between the thin film and the substrate; carrying out interface adhesion sensitive analysis on composite parameters to determine key parameters; calculating a theoretical frequency dispersion curve of transmitting ultrasonic surface waves in a layered structure when the adhesion between the thin film and the substrate is considered; acquiring an experiment frequency dispersion curve of the surface waves; obtaining a measured value of the adhesion of the thin film. The nondestructive testing method provided by the invention can realize quantitative characterization of the adhesion of the thin film.

Description

technical field [0001] The invention belongs to the technical fields of nondestructive testing and ultrasonic surface waves, and relates to a method for nondestructive testing of thin film properties. Background technique [0002] The rapid development of Ultra Large Scale Integration (ULSI) poses a greater challenge to the ULSI interconnection wiring system. In the International Roadmap for Semiconductor Technology Development (ITRS), it is pointed out that in order to correctly characterize parameters such as mechanical properties and adhesion properties of low-k interconnect films, advanced testing techniques need to be developed. The adhesion of the interconnection film is a critical factor for the chemical mechanical polishing (CMP) process in the integrated circuit production process, the reliability of the product, and the lifetime of the product. In terms of film adhesion testing, traditionally commonly used methods include scratch method, four-point bending method,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 肖夏戚海洋
Owner TIANJIN UNIV
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