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Mask plate, method for preparing organic light-emitting display device

A light-emitting display and mask technology, which is used in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc. The effect of product yield

Active Publication Date: 2018-06-26
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is the problem that the conductive terminals of integrated circuits and flexible circuit boards in existing organic light emitting display devices are easily corroded by water and oxygen, so as to provide an organic light emitting display device for vapor deposition that is resistant to water and oxygen corrosion The mask plate is used for vapor deposition to prepare an organic light emitting display device, and a protective layer can be formed on the conductive terminals of the integrated circuit and the flexible circuit board to protect electrode leads, integrated circuits and The conductive terminals of the flexible circuit board are protected from water and oxygen corrosion, thereby effectively improving the water and oxygen corrosion resistance of the organic light emitting display device, thereby improving the product reliability and product yield of the organic light emitting display device

Method used

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  • Mask plate, method for preparing organic light-emitting display device
  • Mask plate, method for preparing organic light-emitting display device
  • Mask plate, method for preparing organic light-emitting display device

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Embodiment 1

[0035] Such as image 3 As shown, this embodiment provides a mask plate, the mask plate includes a shielding area 9 and an opening area, and the opening area includes:

[0036] An IC opening area 10, the IC opening area 10 is set at a position corresponding to the IC bonding area 4 of the organic light-emitting display device;

[0037] The FPC opening area 11, the FPC opening area 11 is arranged at a position corresponding to the FPC bonding area 5 of the organic light emitting display device;

[0038] The display area opening area 8 is arranged at a position corresponding to the display area 3 of the organic light emitting display device.

[0039] Such as figure 1 As shown, this embodiment also provides an organic light-emitting display device and a preparation method thereof, and the preparation method of the organic light-emitting display device includes the following steps:

[0040] S1, forming organic light emitting diodes in the display area 3 on the substrate 1, and ...

Embodiment 2

[0047] This embodiment provides a mask plate, such as Figure 5 As shown, the mask plate includes a shielding area 9 and an opening area, and the opening area includes:

[0048] The display area opening area 8 corresponds to the position of the display area 3 provided in the organic light emitting display device.

[0049] The lead opening area 12 corresponds to the position of the electrode lead area 6 provided in the organic light emitting display device.

[0050] This embodiment also provides an organic light-emitting display device and a preparation method thereof, such as figure 2 As shown, the preparation method of the organic light-emitting display device includes the following steps:

[0051]S1. Form organic light emitting diodes in the display area 3 on the substrate 1, and form IC bonding terminals, FPC bonding terminals, and electrode leads in the IC bonding area 4, FPC bonding area 5, and electrode lead area 6, respectively.

[0052] S2. Cover the mask plate on ...

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Abstract

The invention relates to a mask plate and a method for preparing an organic light-emitting display device. The mask plate can form protective layers on conductive terminals in electrode lead regions, an IC bonding region and an FPC bonding region through an evaporation process in an organic light-emitting display device preparation process, and prevents the conductive terminals in the electrode lead regions, the IC bonding region and the FPC bonding region from being corroded by water and oxygen in the production process of the organic light-emitting display device, so that the water and oxygen corrosion resistance of the organic light-emitting display device is effectively improved; and the product reliability and the product yield of the organic light-emitting display device are improved.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a mask plate used for vapor deposition of an organic light-emitting display device resistant to water and oxygen corrosion, and a method for preparing the organic light-emitting display device. Background technique [0002] As a new generation of display devices, organic light-emitting display devices (English full name organic lighting emitting display, referred to as OLED) have incomparable advantages over traditional display devices, such as self-illumination, no need for backlight, ultra-thin display and flexible display, and driving voltage. Low, fast response, etc. However, in the production process of organic light-emitting display devices, various terminals and leads exposed to the air are easily affected by factors such as water and oxygen, and adverse phenomena such as oxidation and corrosion occur, which have a great impact on the life of organic light-emitting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56
Inventor 甘帅燕朱修剑
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD