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Rigid-flex board and mobile terminal

A technology of flexible and rigid boards and main boards, which is applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., can solve problems such as damage, copper foil layer cracks, cracks, etc., to improve the reliability of use and strengthen the structure Strength, the effect of ensuring the reliability of the connection

Active Publication Date: 2018-09-04
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when the flexible and rigid board is plugged and connected to the electronic components, at least one via hole is usually opened on the copper foil layer to connect with the electronic components; and because the copper foil layer is usually arranged on the flexible substrate layer , therefore, its texture is relatively soft; when the via hole is plugged in and connected with electronic components, it is easy to cause cracks or damage to the surface around the via hole due to excessive force on the via hole, which will cause the copper foil layer to appear Cracks or damage will affect the connection between vias and electronic components, and will also easily cause product connection failure, which cannot guarantee the reliability of the flexible and rigid board

Method used

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  • Rigid-flex board and mobile terminal
  • Rigid-flex board and mobile terminal

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] For ease of description, spatially relative terms such as "under", "beneath", "below", "above", "on" and other spatially relative terms may be used herein to describe an element as shown in the drawings Or the relationship of a feature to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly...

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Abstract

The invention provides a flexible-rigid combined board and a mobile terminal. The flexible-rigid combined board comprises a flexible substrate layer and a copper foil layer, wherein the copper foil layer is arranged on the flexible substrate layer in a laminated manner; the surface of the copper foil layer is provided with at least one via hole and reinforcing elements; the at least one via hole runs through the flexible substrate layer; and each reinforcing element is arranged around the periphery of each via hole. According to the flexible-rigid combined board and the mobile terminal provided by the invention, the reinforcing elements are arranged on the peripheries of the via holes on the copper foil layer; and the via holes are reinforced by the reinforcing effects of the reinforcing elements, so that, when the via holes and an electronic component are in pluggable connection, the reinforcing elements can strengthen the structural strength of the copper foil layer on the peripheries of the via holes to prevent the peripheries of the via holes from cracking or being damaged; the connection reliability of the via holes and the electronic component is ensured; and the usage reliability of the flexible-rigid combined board is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a rigid-flex board and a mobile terminal. Background technique [0002] Rigid-flex boards are flexible circuit boards and rigid circuit boards, which are combined according to relevant process requirements through pressing and other processes to form circuit boards with the characteristics of flexible circuit boards and rigid circuit boards. [0003] At present, when the flexible and rigid board is plugged and connected to the electronic components, at least one via hole is usually opened on the copper foil layer to connect with the electronic components; and because the copper foil layer is usually arranged on the flexible substrate layer , therefore, its texture is relatively soft; when the via hole is plugged in and connected with electronic components, it is easy to cause cracks or damage to the surface around the via hole due to excessive force on the via hole, which ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/14
CPCH05K1/0281H05K1/147H05K2201/058H05K2201/09636
Inventor 曾元清
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD