Pad design for electrostatic chuck surface

Abstract

The invention provides a pad design for electrostatic chuck surface. Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

Description

technical field [0001] Embodiments disclosed herein relate generally to fabricating electrostatic chuck surfaces; more specifically, embodiments disclosed herein generally relate to masks and patterns for electrostatic chucks. Background technique [0002] Electrostatic chucks are widely used to hold substrates such as semiconductor wafers during substrate processing in process chambers for various applications such as physical vapor deposition (PVD), etching or chemical vapor deposition. Electrostatic chucks typically include one or more electrodes embedded within a monolithic chuck body comprising a dielectric or semiconducting ceramic material on which an electrostatic clamping field can be generated. Semiconducting ceramic materials such as aluminum nitride, boron nitride or aluminum oxide doped with metal oxides can be used, for example, to enable the generation of a Johnson-Rahbek or non-Coulombic electrostatic clamp field. [0003] Variability in the chucking force ...

AI Technical Summary

Problems solved by technology

Heat transfer that occurs at the contact area may exceed the physical limits of the substrate and / or chuck, causing cracking or fracture and potentially generating and depositing particles on the chuck surface that can cause further damage

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