A kind of resin composition and its application
A technology of resin composition and mixture, applied in the direction of in-line phenolic epoxy resin adhesive, epoxy resin glue, synthetic resin layered products, etc., can solve the problems of insufficient heat resistance and adhesion, and improve reliability. Sex, solve the effect of easy separation
Active Publication Date: 2018-06-05
SHAANXI SHENGYI TECH
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AI Technical Summary
Problems solved by technology
[0006] The purpose of the present invention is to provide a resin composition that solves the problem of blistering and delamination between the base material of the laminate and the copper foil caused by insufficient heat resistance and adhesion of the existing resin composition
Method used
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Effect test
Embodiment 5
[0058] Compared with Example 5 and Comparative Examples 5 and 6, the bisphenol F epoxy resin (A-2) with an epoxy equivalent of 3200 and the bromine-containing phenoxy resin (B-1) with a weight average molecular weight of 30000-35000 are in The content in the system cannot exceed the range stated in the claims. Once it exceeds this range, the plate where the system is located will cause low peel strength and poor dip solder resistance.
[0059] In summary, the present invention has outstanding effects on improving the adhesion and heat resistance of copper clad laminates; it solves the problem that thick copper clad laminates are easy to separate thick copper from the substrate and poor adhesion under high temperature conditions. Such problems have improved the reliability of thick copper-clad laminates in high temperature environments during subsequent processing, and can achieve V-0 flame retardancy.
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Abstract
The invention discloses a resin composition. The resin composition comprises the following components in parts by weight of solids: 30-60 parts of high-epoxide-equivalent epoxy resin, 25-55 parts of phenoxy resin, 3-8 parts of a rubber elastomer, 0.5-2 parts of a curing agent, and 1-2 parts of a flame retardant, wherein the equivalent of the high-epoxide-equivalent epoxy resin is 2600-4000g / eq, the functionality of the epoxy resin is 2-4, and the weight-average molecular weight of the phenoxy resin is 20000-40000. The resin composition disclosed by the invention has an outstanding effect of improving the heat resistance and cohesiveness of a thick-copper-foil-coated laminated sheet; and the problems that under a high-temperature condition, thick copper and a substrate material of the thick-copper-foil-coated laminated sheet are easy to separate, the thick-copper-foil-coated laminated sheet is poor in cohesiveness, and the like, the reliability of the thick-copper-foil-coated laminated sheet in subsequent processing in a high-temperature environment is improved, and the flame-retardant property of the thick-copper-foil-coated laminated sheet can reach a V-0 level.
Description
Technical field [0001] The invention belongs to the technical field of copper-clad laminates, and specifically relates to a resin composition. The invention also relates to an adhesive film and a copper-clad laminate prepared by using the resin composition. Background technique [0002] With the rapid development of the electronics industry, the size of electronic products is getting smaller and smaller, and the power density is getting larger and larger. Copper clad laminates produced with ordinary copper foil cannot meet the requirements of high-power and large-current circuits. Thick copper-clad laminates are made by laminating an adhesive film made from a resin composition and a prepreg, and then covering one or both sides with copper foil and hot pressing. It has good thermal conductivity and electrical signal interference shielding. It is an effective means to solve this problem. [0003] When the thickness of the copper foil is greater than 6oz, considering the cost, the in...
Claims
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IPC IPC(8): C09J163/00C09J163/04C09J11/08C09J11/06C09J7/00B32B15/092B32B15/20B32B27/18
CPCB32B15/092B32B15/20B32B27/18C08L2201/02C08L2201/08C08L2203/20C08L2205/03C09J7/00C09J11/06C09J11/08C09J163/00C09J163/04C09J2203/326C09J2301/408C09J2463/00C08L71/12C08L9/02C08K5/5399C08L83/04
Inventor 杨菲
Owner SHAANXI SHENGYI TECH