Resin composition and application thereof
A technology of resin composition and mixture, applied in the direction of online phenolic epoxy resin adhesive, epoxy resin glue, synthetic resin layered products, etc., can solve the problems of insufficient heat resistance and adhesion, and achieve improved reliability sex, solve the effect of easy separation
Active Publication Date: 2016-07-06
SHAANXI SHENGYI TECH
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AI Technical Summary
Problems solved by technology
[0006] The purpose of the present invention is to provide a resin composition that solves the problem of blistering and delamination between the base material of the laminate and the copper foil caused by insufficient heat resistance and adhesion of the existing resin composition
Method used
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Effect test
Embodiment 5
[0058] Embodiment 5 compares with comparative example 5,6, epoxy equivalent is that the bisphenol F type epoxy resin (A-2) of 3200 and the bromine-containing phenoxy resin (B-1) that weight-average molecular weight is 30000-35000 in The content in the system cannot exceed the range stated in the claims. Once the range is exceeded, the board where the system is located will cause low peel strength and poor dip soldering resistance.
[0059] In summary, the present invention has a prominent effect on improving the adhesion and heat resistance of copper-clad laminates; it solves the problem that thick copper-clad laminates are easy to separate from the base material and have poor adhesion under high temperature conditions. And other problems, improve the reliability of thick copper clad laminates in high temperature environment during subsequent processing, and can achieve V-0 level flame retardancy.
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Abstract
The invention discloses a resin composition. The resin composition comprises the following components in parts by weight of solids: 30-60 parts of high-epoxide-equivalent epoxy resin, 25-55 parts of phenoxy resin, 3-8 parts of a rubber elastomer, 0.5-2 parts of a curing agent, and 1-2 parts of a flame retardant, wherein the equivalent of the high-epoxide-equivalent epoxy resin is 2600-4000g / eq, the functionality of the epoxy resin is 2-4, and the weight-average molecular weight of the phenoxy resin is 20000-40000. The resin composition disclosed by the invention has an outstanding effect of improving the heat resistance and cohesiveness of a thick-copper-foil-coated laminated sheet; and the problems that under a high-temperature condition, thick copper and a substrate material of the thick-copper-foil-coated laminated sheet are easy to separate, the thick-copper-foil-coated laminated sheet is poor in cohesiveness, and the like, the reliability of the thick-copper-foil-coated laminated sheet in subsequent processing in a high-temperature environment is improved, and the flame-retardant property of the thick-copper-foil-coated laminated sheet can reach a V-0 level.
Description
technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a resin composition. The invention also relates to an adhesive film and a copper-clad laminate prepared by using the resin composition. Background technique [0002] With the rapid development of the electronics industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher. Copper clad laminates produced with ordinary copper foil cannot meet the requirements of high-power and high-current circuits. Thick copper clad laminates are formed by laminating an adhesive film made of a resin composition and a prepreg, and then covering one or both sides with copper foil and hot pressing. It has good thermal conductivity and electrical signal interference shielding. is an effective means to solve this problem. [0003] When the thickness of the copper foil is greater than 6oz, considering the cost, th...
Claims
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IPC IPC(8): C09J163/00C09J163/04C09J11/08C09J11/06C09J7/00B32B15/092B32B15/20B32B27/18
CPCB32B15/092B32B15/20B32B27/18C08L2201/02C08L2201/08C08L2203/20C08L2205/03C09J7/00C09J11/06C09J11/08C09J163/00C09J163/04C09J2203/326C09J2301/408C09J2463/00C08L71/12C08L9/02C08K5/5399C08L83/04
Inventor 杨菲
Owner SHAANXI SHENGYI TECH