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Method for controlling heat treatment forming diversity of silicon-based microstructures

A technology of silicon-based microstructure and warm heat treatment, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problem that there is no guiding significance for the optimization of the processing process, and it is impossible to reveal the law of the variety of processing morphology changes, etc. question

Active Publication Date: 2016-07-20
王颐疆
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these results are still unable to reveal the law of the diversity of processing morphology, so there is no guiding significance for the optimization of the processing process.

Method used

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  • Method for controlling heat treatment forming diversity of silicon-based microstructures
  • Method for controlling heat treatment forming diversity of silicon-based microstructures
  • Method for controlling heat treatment forming diversity of silicon-based microstructures

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Embodiment Construction

[0022] The preferred embodiments of the present invention will be described in detail below.

[0023] In this embodiment, the material used for the research on the formation of silicon-based microstructures by thermal treatment is a polished 6-in (100) n-type silicon wafer; it is softened after being treated for a period of time in a certain temperature environment; figure 1 U-shaped cylindrical bore shown (sample).

[0024] The U-shaped cylindrical hole obtained by the above process is heat-treated in an environment of 500°C-1400°C to obtain such figure 2 Morphology of the silicon-based microstructure shown.

[0025] In this embodiment, by changing the heat treatment temperature and time, the formation of silicon-based microstructures has diversity. The sample is heat-treated in an environment of 500-1400 ° C. At the same time, different temperatures can obtain different silicon-based microstructures; at the same temperature , different heat treatment time to get different...

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Abstract

The invention discloses a method for controlling heat treatment forming diversity of silicon-based microstructures. The method comprises the following steps: step one, increasing alpha=Ds / D value, performing heat treatment on a sample in the same temperature environment, to obtain a first silicon-based microstructure; step two, increasing alpha=Ds / D value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a second silicon-based microstructure; step three, increasing alpha=Ds / D value, performing heat treatment on the sample for the same time in step two and at the same temperature in step two, to obtain a third silicon-based microstructure; step four, increasing tan(theta)=(D+Ds) / H value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a fourth silicon-based microstructure; step five, increasing tan(theta)=(D+Ds) / H value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a fifth silicon-based microstructure; step six, increasing tan(theta)=(D+Ds) / H value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a sixth silicon-based microstructure; step seven, increasing the alpha value and the tan(theta) value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, taking four initial state values, to respectively obtain the sixth silicon-based microstructure, seventh silicon-based microstructure, eighth silicon-based microstructure and ninth silicon-based microstructure; using tan(theta)=(D+Ds) / H as the X-coordinate and using alpha=Ds / D as the Y-coordinate, to obtain change states of the silicon-based microstructures.

Description

technical field [0001] The invention belongs to the technical field of micro-nano manufacturing, and in particular relates to a method for controlling the diversity of silicon-based microstructures by heat treatment and forming. Background technique [0002] MEMS (Micro-Electro-Mechanical System) is also called micro-electro-mechanical system, micro-system, micro-machine, etc. Wide application can effectively improve the automation and intelligence of the system. [0003] Silicon material is one of the main materials for MEMS manufacturing. A three-dimensional structure with a size of micron is produced on a silicon chip to realize the perception and control of external information, which can constitute a multifunctional micro system. In recent years, various disciplines have been persistently trying various new scientific and technological methods to design and manufacture silicon-based microstructure Silicon on nothing (SON) and apply it to various mechanical devices, suc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81C1/0069B81C2201/0161
Inventor 张俐楠郑伟吴立群
Owner 王颐疆