Method for controlling heat treatment forming diversity of silicon-based microstructures
A technology of silicon-based microstructure and warm heat treatment, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problem that there is no guiding significance for the optimization of the processing process, and it is impossible to reveal the law of the variety of processing morphology changes, etc. question
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[0022] The preferred embodiments of the present invention will be described in detail below.
[0023] In this embodiment, the material used for the research on the formation of silicon-based microstructures by thermal treatment is a polished 6-in (100) n-type silicon wafer; it is softened after being treated for a period of time in a certain temperature environment; figure 1 U-shaped cylindrical bore shown (sample).
[0024] The U-shaped cylindrical hole obtained by the above process is heat-treated in an environment of 500°C-1400°C to obtain such figure 2 Morphology of the silicon-based microstructure shown.
[0025] In this embodiment, by changing the heat treatment temperature and time, the formation of silicon-based microstructures has diversity. The sample is heat-treated in an environment of 500-1400 ° C. At the same time, different temperatures can obtain different silicon-based microstructures; at the same temperature , different heat treatment time to get different...
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