Diversity Control Method of Silicon-Based Microstructure Warm Heat Treatment Forming

Abstract

The invention discloses a method for controlling heat treatment forming diversity of silicon-based microstructures. The method comprises the following steps: step one, increasing alpha=Ds / D value, performing heat treatment on a sample in the same temperature environment, to obtain a first silicon-based microstructure; step two, increasing alpha=Ds / D value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a second silicon-based microstructure; step three, increasing alpha=Ds / D value, performing heat treatment on the sample for the same time in step two and at the same temperature in step two, to obtain a third silicon-based microstructure; step four, increasing tan(theta)=(D+Ds) / H value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a fourth silicon-based microstructure; step five, increasing tan(theta)=(D+Ds) / H value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a fifth silicon-based microstructure; step six, increasing tan(theta)=(D+Ds) / H value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, to obtain a sixth silicon-based microstructure; step seven, increasing the alpha value and the tan(theta) value, performing heat treatment on the sample for the same time in step one and at the same temperature in step one, taking four initial state values, to respectively obtain the sixth silicon-based microstructure, seventh silicon-based microstructure, eighth silicon-based microstructure and ninth silicon-based microstructure; using tan(theta)=(D+Ds) / H as the X-coordinate and using alpha=Ds / D as the Y-coordinate, to obtain change states of the silicon-based microstructures.

Description

Technical field [0001] The invention belongs to the technical field of micro-nano manufacturing, and specifically relates to a method for controlling the diversity of silicon-based microstructures by warm heat treatment. Background technique [0002] MEMS (Micro-Electro-Mechanical System) is also called micro-electro-mechanical system, micro-system, micro-machine, etc. It is developed on the basis of micro-electronic technology (semiconductor manufacturing technology). It is used in aerospace, automotive industry, consumer electronics and other electronic information fields Widely used, it can effectively improve the automation and intelligence of the system. [0003] Silicon material is one of the main materials for MEMS manufacturing. A three-dimensional structure with a size of micrometers can be fabricated on a silicon wafer to realize the perception and control of external information and form a multi-functional micro system. In recent years, various disciplines have persiste...

AI Technical Summary

Problems solved by technology

However, these results are still unable to reveal the law of the diversity of processing morphology, so there is no guiding significance for the optimization of the processing process.

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