Method for making closed-cavity structural ceramic parts for high-frequency and high-speed ceramic packaging shells
A technology of ceramic packaging and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve the problems that it is difficult to meet the design requirements of ceramic shells with higher frequencies and speeds, and achieve good applicability.
Active Publication Date: 2019-03-26
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology
Relying on the traditional multi-layer ceramic shell processing technology, a narrower wiring width of the internal RF lines of the ceramic is required, and the screen printing process used for the internal lines is due to its own process characteristics - screen mesh, metal paste and printing processing It is difficult to meet the design requirements of ceramic shells with higher frequencies and speeds due to constraints such as manufacturability
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[0023] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.
[0025] Such as figure ...
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The invention discloses a method for manufacturing a ceramic part with a closed cavity structure for a high-frequency high-speed ceramic package shell, and relates to the technical field of preparation of semiconductor microelectronic devices. The method comprises the following steps: preparing a green tape material; slotting holes at positions where slotting is required and a cavity needs to be formed on the cut green tape material by adopting slotting equipment, and forming the cavity; printing necessary metallization patterns on corresponding positions of a surface and a side wall of a green ceramic piece by adopting a screen printing method; filling a sacrificial material in the formed cavity; carrying out a lamination treatment on the overlapped green ceramic piece, and adjusting and controlling the density among layers and the shape of the cavity by process parameters; sintering a prepared green ceramic part to prepare the ceramic part with the closed cavity structure, wherein in a sintering process of the green ceramic part, the sacrificial material is burnt out. The interior of the closed cavity of the ceramic part prepared by the method has good appearance, and the signal transmission requirements of higher frequency can be met by wiring on the bottom side face of the closed cavity.
Description
technical field [0001] The invention relates to the technical field of semiconductor microelectronic device preparation, in particular to a method for manufacturing a closed-cavity structural ceramic part for a high-frequency, high-speed ceramic packaging shell. Background technique [0002] The ceramic parts are alumina ceramics, but not limited to alumina ceramics, aluminum nitride ceramics, LTCC and other ceramics. The traditional multi-layer ceramic processing adopts tape casting process to prepare green ceramic strips, which are cut into standard-sized green ceramic sheets, and punching equipment is used to process positioning holes and cavities on the green ceramic sheets, and tungsten paste is used on the surface of the green ceramic sheets material or molybdenum paste, gold, silver, copper and other conductive pastes can also be used, metallized graphics are printed by precision screen printing technology, multi-layer raw ceramic sheets are stacked, laminated, and th...
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IPC IPC(8): H01L21/48H01L23/053
Inventor 郑欣刘林杰吴亚光丁飞任才华陈军伟张义政白洪波
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP