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Coated panel and method for manufacturing such panel

A board and floor technology, applied in the field of board manufacturing, can solve problems such as wear or moisture penetration, unprotected patterns, etc., and achieve the effect of small rounded parts

Active Publication Date: 2016-08-10
FLOORING IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, with these techniques it is difficult to achieve in a smooth manner a structure corresponding to the pattern provided by printing
Furthermore, according to some known techniques, the pattern remains partially unprotected against eg abrasion or moisture penetration

Method used

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  • Coated panel and method for manufacturing such panel
  • Coated panel and method for manufacturing such panel
  • Coated panel and method for manufacturing such panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0082] figure 1 Some steps S1-S5 in the method of manufacturing a coated sheet 1 are schematically shown. Each coated board 1 is of the type comprising at least a substrate 2 , for example an MDF or HDF substrate, and a top layer 3 provided on this substrate 2 . In this example, the top layer 3 consists of a plurality of material layers 4 - 7 , between which the material layer 5 exhibits a pattern and is applied in the form of a printing 8 carried out directly on the substrate 2 during step S2 .

[0083] In the preceding step S1, one or more primer layers 4 are provided on the surface of the substrate 2 to be patterned. These layers may have the purpose of providing a smooth subsurface and / or providing a uniform or quasi-uniform Background color and / or adhesive base coat.

[0084] figure 2 The result of step S1 is shown and shows that a possibly uneven surface of the substrate 2 can be made flat or nearly flat by the one or more primer layers 4 .

[0085] In this example...

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PUM

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Abstract

Coated panel of the type comprising at least a substrate (2) and a top layer (3) with a printed motif, said top layer being provided on this substrate (2), wherein the method for manufacturing the top layer(3) comprises at least two steps: a first step(s4) of providing a synthetic material layer (7) and a second follow-up step(s5) of providing embossments on the synthetic material layer (7). The embossments comprise grooves and / raised patterns, the embossments are obtained through at least locally adding and / decreasing the volume of the top layer and / or the substrate, wherein the patterns can be at least partially determined by printing swelling agents, swelling accelerant or anti-swelling agents.

Description

[0001] This application entered the Chinese national phase on June 20, 2011, the PCT international application number is PCT / IB2009 / 055148, the application date is November 18, 2009, the Chinese application number is 2000980151432.X, and the invention name is "manufacturing board The divisional application of the patent application for the method of ", the entire content of which is incorporated herein by reference. [0002] This application claims the benefit of US Provisional Application No. 61 / 139,286, filed December 19, 2008, under Section 119(e) of the US Code. technical field [0003] The present invention relates to a method of manufacturing panels, and panels obtainable by such methods. [0004] More specifically, the invention relates to a method of manufacturing a panel of the type comprising at least a base plate and a top layer with a pattern, said top layer being arranged on the base plate. In this context this may relate eg to furniture panels, ceiling panels, f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B44C1/10B44C1/20B44C1/22B44C5/04E04F13/08E04F15/02
CPCB44C1/10B44C1/20B44C1/22B44C5/04B44C5/043B44C5/0453E04F13/08E04F15/02E04F15/02033Y10T428/24884E04F13/0866E04F13/0871E04F15/107B41F17/00B44F9/02B44F9/04
Inventor 本尼·沙赫特菲利佩·塔克
Owner FLOORING IND LTD