a binding device

Abstract

The invention relates to a bundling device. The bundling device comprises a support, wherein a wire feeding and cutting-off mechanism, a bundling wire forming mechanism, a bundling wire placing mechanism and a bundling wire rotating mechanism are arranged on the support; the wire feeding and cutting-off mechanism cuts off a bundling wire by fixed length after neatening the bundling wire; the bundling wire conveyed from the wire feeding and cutting-off mechanism is bent and formed by the bundling wire forming mechanism; the bundling wire placing mechanism conveys the bundling wire formed by the bundling wire forming mechanism to a material platform so that a bundled object is surrounded by the bundling wire; the bundling wire rotating mechanism tightens two ends of the bundling wire by twisting to finish bundling; the material platform is mounted on a rotating device; and a plurality of bundling grooves for the bundling wire to pass through are formed in a platform body of the material platform. The length and the shape of the bundling wire can be adjusted quite conveniently by adjusting parameters of a controller; and meanwhile, a pressing plate is arranged at the bottom of the bundling wire rotating mechanism, during bundling, the pressing plate presses a coil of the wire, shifting of the coil of the wire during wire twisting is avoided, and therefore, stability and reliability of the product are improved.

Description

technical field [0001] The invention relates to the field of machinery, in particular to a bundling device for annular coils. Background technique [0002] For example, Bulletin No. CN 105173171A discloses a binding machine, comprising a placing table for placing objects to be bound, a wire feeding device for sending a binding wire under the objects to be bound, and a binding device for binding the objects to be bound with the binding wire The bundling device is located above the placing table, and the bundling device includes two bundling thread grippers, a bundling lateral movement mechanism for controlling the lateral movement of the two bundling thread grippers, a rotating thread gripper and a control station. The rotating mechanism for the rotation of the rotary thread clamp, the two bundled thread clamps are respectively located on both sides of the rotary thread clamp; a U-shaped wire forming device is arranged between the binding device and the wire feeding device, a...

AI Technical Summary

Problems solved by technology

[0003] This strapping machine is equipped with a U-shaped wire forming device between the strapping device and the wire feeding device. When the size of the bundled object is changed, the U-shaped frame needs to be replaced. In addition, the strapping device includes two strapping clamps for controlling The binding lateral movement mechanism for the lateral movement of the two binding clamps, the rotating clamp and the rotating mechanism for controlling the rotation of the rotating clamp, and the binding wire needs to be transferred from the two binding clamps to the rotating clamp during bundling At the same time, there is a problem of off-line in the process of transferring the binding wire from the two binding wire grippers to the rotating wire gripper, which seriously affects the reliability of the machine.

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