Camera module based on molding process

Abstract

A camera module based on molding technology, which includes: a lens, a photosensitive chip and a circuit board assembly; wherein the photosensitive chip is mounted on the circuit board assembly, and the lens is located in the photosensitive path of the photosensitive chip The circuit board assembly includes a circuit board part and a packaging part, the packaging part is integrally packaged and connected to the circuit board part based on a molding process, and the packaging part has a through hole to provide a photosensitive path for the photosensitive chip .

Description

technical field [0001] The present invention relates to the field of camera modules, and further relates to a camera module based on molding technology. Background technique [0002] Such as figure 1 As shown, it is a schematic diagram of a camera module in a traditional COB (Chip On Board) process. The camera module includes a circuit board 1P, a photosensitive chip 2P, a base 3P, a filter 4P, a motor 5P and a lens 6P. The photosensitive chip 2P is installed on the circuit board 1P, the optical filter 4P is installed on the base 3P, the lens 6P is installed on the motor 5P, and the motor 5P is installed on the base 3P. [0003] The optical system of the camera molding is a key factor affecting the imaging quality of the camera module, and the optical system is closely related to the optical axis of the lens 6P, the filter 4P, and the photosensitive chip 2P and the light incident line of defense. big relationship. In the transmission camera module, the function of the b...

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Problems solved by technology

[0004] However, the base 3P of the traditional COB process is usually a plastic bracket, which is fixed to the circuit board 1P by bonding, and there are many unfavorable factors

[0005] First of all, the traditional base 3P is poor in flatness due to its own manufacturing factors, so it cannot provide good installation conditions for the motor 5P, the lens 6P and the filter 4P, so that the The motor 5P, the lens 6P and the filter 4P are prone to inclination or deviation, so the requirements for the installation process precision of the motor 5P, the lens 6P and the filter 4P are relatively high

[0006] Secondly, the traditional base 3P is usually bonded to the circuit board 1P, so when the base 3P is installed and fixed, it is prone to inclination or deviation, which further increases the cumulative error of the camera module as a whole

[0007] In addition, some circuit devices 11P are usually installed on the circuit board 1P, such as resistors, capacitors, etc. These circuit devices 11P protrude from the surface of the circuit board 1P, and the base 3P needs to be installed on a The circuit board 1P of the circuit device 11P, and the assembly and cooperation relationship between the circuit board 1P, the circuit device 11P and the bracket 3P in the traditional COB process has some unfavorable factors, which is the installation space of the base 3P. Smaller, which increases the demand for the horizontal size of the camera module

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