Semiconductor packages with multilayer substrates
A technology of semiconductors and power semiconductors, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as damage to power semiconductor devices and circuits, cracking of ceramic SMD packages, loss of package airtightness, etc.
Active Publication Date: 2018-10-26
INFINEON TECH AMERICAS CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Thermal stress can produce cracks in ceramic SMD packages, which can lead to loss of hermeticity of the package and damage to power semiconductor devices and circuits within the package
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[0013] The following description contains specific information pertaining to the embodiments in this disclosure. The drawings in this application and their detailed description are for exemplary embodiments only. Unless otherwise stated, identical or corresponding elements in the drawings may be indicated by identical or corresponding reference numerals. Furthermore, the drawings and descriptions in this application are generally not to scale and are not intended to correspond to actual relative dimensions.
[0014] refer to Figure 1A and Figure 1B , Figure 1A Illustrated is a perspective view of a portion of an exemplary semiconductor package 100 in accordance with one embodiment of the present application. Figure 1B Illustrated according to one embodiment of the application Figure 1A A cross-sectional view of the exemplary semiconductor package 100 along line B-B in . like Figure 1A As shown in , a semiconductor package 100 is mounted on a substrate 102 . Semic...
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A semiconductor package having a multilayer substrate is provided. A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic housing, a conductive base coupled to the semiconductor die at a top surface of the conductive base, wherein the conductive base includes a A first layer of (CTE) and a second layer having at least one mounting tab and a second CTE. The conductive base is configured to reduce thermal stress in the ceramic housing, wherein the first CTE is the same or slightly different than the ceramic housing's CTE, the second CTE is greater than the first CTE, and the PCB's CTE is greater than or equal to the second CTE. The conductive substrate is configured to electrically couple the power electrodes of the semiconductor die to the PCB.
Description
[0001] Cross References to Related Applications [0002] This application claims the benefit and priority of Provisional Patent Application Serial No. 62 / 121,364, filed February 26, 2015, entitled "Ceramic Package with CompositeBase." The disclosure in this provisional application is hereby fully incorporated by reference into this application. Background technique [0003] Surface mount device (SMD) packages may be used to house and connect semiconductor devices directly to a printed circuit board (PCB). A large number of electronic circuit designs have integrated SMD packages due to the various benefits that surface mount devices can provide. For example, in military and space applications (such as high-performance vehicles, aircraft, space shuttles, and satellites) where high reliability is necessary, ceramic SMD packages can provide the stability required in extreme or harsh environments, while providing features such as more Benefits of small size, lighter weight and e...
Claims
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IPC IPC(8): H01L23/00H01L23/043H01L23/08
CPCH01L23/043H01L23/08H01L23/562H01L2924/10344H01L23/049H01L24/06H01L24/29H01L24/32H01L24/48H01L24/49H01L24/73H01L2224/04026H01L2224/04042H01L2224/06181H01L2224/291H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/48472H01L2224/4903H01L2224/49111H01L2224/73265H01L2924/10253H01L2924/1027H01L2924/10272H01L2924/1032H01L2924/1033H01L2924/16195H05K2201/068H01L23/4952H01L23/49555H01L23/49562H01L23/49844H01L2924/00014H01L2924/181H01L2924/13055H05K1/181Y02P70/50H01L2924/00012H01L2924/014H01L2224/45099H01L2224/45015H01L2924/207H01L2924/00H01L23/373H01L23/49866
Inventor 熊顺和G·马隆尼
Owner INFINEON TECH AMERICAS CORP