Heat dissipation structure and projection device
A technology for a heat dissipation structure and a projection device, which is applied to projection devices, instruments, optics, etc., can solve the problems of large overall size and volume of the heat dissipation fins, which are not conducive to the miniaturization of the projection device, and achieve convenient storage and portability. Small, effective heat dissipation
Inactive Publication Date: 2018-10-12
QISDA SUZHOU +1
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[0003] The projection device has more heating units, so it will generate high heat during projection. In order to control the temperature of the projection device so that the projection device can work normally, cooling fins are installed inside the projection device to dissipate heat from the projection device. , and in order to dissipate heat well for the projection device, the overall size of the heat dissipation fins needs to be designed larger, and the existing heat dissipation fins are all rigid structures, so that the projection device, especially the high-lumen projection with high heat generation The volume of the device is large, which is not conducive to portability and miniaturization of the projection device
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[0039] In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.
[0040] see Figure 1 to Figure 10 as shown, figure 1 is a schematic cross-sectional view of the heat dissipation structure 100 proposed in the first embodiment of the present invention in the first state, figure 2 is a schematic cross-sectional view of the heat dissipation structure 100 proposed in the first embodiment of the present invention in the second state, image 3 for figure 1 The structure diagram of the heat dissipation structure 100 shown in the first state in another direction, Figure 4 for figure 2 The structure diagram of the heat dissipation structure 100 shown in the second state in another direction, Figure 5 It is a structural schematic diagram of some elements of the heat dissipation structure 100 proposed in the first embodiment of the pr...
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The invention discloses a heat dissipation structure and a projection device. The heat dissipation structure comprises a plurality of heat dissipation units, wherein a first heat dissipation unit and a second heat dissipation unit in the plurality of heat dissipation units are movably connected; when the second heat dissipation unit moves relative to the first heat dissipation unit towards the direction close to the first heat dissipation unit along the first direction, the heat dissipation structure is changed into a second state from a first state; the heat dissipation structure has a first width in the first direction in the first state and has a second width in the first direction in the second state; and the first width is greater than the second width, so that effective heat dissipation can be carried out when the heat dissipation structure is in the first state; the overall size of the heat dissipation structure is reduced when the heat dissipation structure is in the second state; and the heat dissipation structure can be conveniently stored and carried.
Description
technical field [0001] The invention relates to a heat dissipation structure and a projection device, in particular to a movably connected heat dissipation structure and a projection device with the heat dissipation structure. Background technique [0002] A projection device is a device that can project images or videos onto a screen to achieve a large-screen projection display to provide viewers with excellent presentation and visual effects. [0003] The projection device has more heating units, so it will generate high heat during projection. In order to control the temperature of the projection device so that the projection device can work normally, cooling fins are installed inside the projection device to dissipate heat from the projection device. , and in order to dissipate heat well for the projection device, the overall size of the heat dissipation fins needs to be designed larger, and the existing heat dissipation fins are all rigid structures, so that the project...
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IPC IPC(8): G03B21/16
CPCG03B21/16
Inventor 林廷翊
Owner QISDA SUZHOU