A lower electrode, dry etching equipment

Abstract

The invention provides a lower electrode and dry etching equipment, relating to the technical field of display. The lower electrode is applied to dry etching, and a problem that the lower electrode generates same suction force to all parts of a substrate to be etched in the prior art can be solved. The lower electrode comprises a conductive layer and a plurality of air holes which go through the lower electrode. The upper surface of the lower electrode is provided with a plurality of protrusions. The conductive layer comprises a first conductive unit and a second conductive unit at the periphery of the first conductive unit, and the first conductive unit and the second conductive unit do not contact with each other. All air holes are at the gas transmission area of the lower electrode, and the gas transmission area is defined by the outline of the first conductive unit. The invention is suitable for the production of the lower electrode and the dry etching equipment comprising the lower electrode.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a lower electrode and dry etching equipment. Background technique [0002] Dry etching plays an irreplaceable role in the manufacture of display devices. In a dry etching process, plasma is generally used to etch a substrate (mostly a glass substrate). Existing dry etching equipment includes: a reaction chamber, an upper electrode and a lower electrode located in the reaction chamber. In the specific implementation, the substrate to be etched is placed on the lower electrode, the plasma gas is introduced into the reaction chamber, and the reaction chamber is sealed, a voltage is applied to the upper electrode and the lower electrode, and a potential difference is formed between the two; under the action of the electric field , the plasma obtains high energy and bombards the substrate to be etched at a high speed to achieve etching. [0003] During the above etching process, t...

AI Technical Summary

Problems solved by technology

[0007] Embodiments of the present invention provide a lower electrode and dry etching equipment. Applying the lower electrode to dry etching can solve the problem in the prior art that the lower electrode produces the same suction force on all parts of the substrate to be etched.

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