A device and blind insertion method for remote sensing camera multi-chip ccd device blind insertion

Abstract

The invention provides a device used for blind insertion of a multi-chip CCD device of a remote sensing camera and a blind insertion method. Positioning matching between a CCD pin of the CCD device (2) and a plated through hole in a printed circuit board (4) is guaranteed by designing a CCD pin correcting tool, a CCD lengthened contact pin correcting tool and printed board correcting templates with different thicknesses and combining steps of the blind insertion method of the multi-chip CCD device (2) of a remote sensing camera. According to the device and the blind insertion method, one-time blind insertion installation of the printed circuit board and the multi-chip CCD device is realized, and the defect that the pin is bent and broken after blind insertion of the multi-chip CCD device is overcome, so that the installation efficiency is improved, and the economic loss is reduced.

Description

technical field [0001] The invention belongs to the technical field of optical remote sensors, and relates to a device for blind insertion of multiple CCD devices of remote sensing cameras and a method for inserting multiple CCD devices of remote sensing cameras. Background technique [0002] The focal plane assembly of the remote sensing CCD camera is composed of three parts: the focal plane assembly, the focusing mechanism, and the focusing support frame assembly. , bonding, after the implementation of relevant thermal control and mechanical assembly, the one-time blind insertion of printed circuit board assemblies and multiple CCD devices with multiple rows and hundreds of pins is required. [0003] The existing CCD device insertion technology generally has only one CCD device on one plane, and the device pins are only about 50 pins in two rows. The CCD devices are mated and plugged in. However, after optical splicing of CCD devices, the deformation of the pins and the ...

AI Technical Summary

Problems solved by technology

[0003] The existing CCD device insertion technology generally has only one CCD device on one plane, and the device pins are only about 50 pins in two rows. CCD device mating completed

However, after optical splicing of CCD devices, the deformation of the pins and the deformation of the extended pins affect the insertion of the electronic assembly process. Generally, the blind insertion of multiple CCD devices in a plane is difficult to detect with the naked eye. The circuit board and multi-chip CCD devices are mated, and the printed circuit board assembly and multi-chip CCD devices with hundreds of pins are one-time blind plug-in. At present, there is a lack of reliable means, and the efficiency in the assembly process is low. Very low, and it is very easy to bend or even break the pins or pins, causing heavy economic losses

Images