Composite vibration damping method for ruggedized computer mainboard

A technology for strengthening computers and motherboards, which is applied in computing, instruments, electrical digital data processing, etc., can solve problems such as limiting the reliability of motherboards, and achieve the effects of improving reliability of reinforcement, wide application range, and improving vibration and shock resistance

Inactive Publication Date: 2016-11-09
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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AI Technical Summary

Problems solved by technology

The disadvantage of this method is that its mechanical structure is a rigid connection, which is conducive to the transmission of vibration intensity
The second aspect is to use materials with vibration damping properties, such as: springs, rubber, etc., instead of rigid connections. This method is mostly used in the first-level vibration reduction inside the chassis. motherboard reliability

Method used

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  • Composite vibration damping method for ruggedized computer mainboard
  • Composite vibration damping method for ruggedized computer mainboard
  • Composite vibration damping method for ruggedized computer mainboard

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0021] In order to improve the anti-vibration and shock performance of the reinforced computer motherboard and ensure its reliability, as attached figure 1 , figure 2 , image 3 As shown, the present invention provides a kind of compound damping method of reinforcing computer motherboard, and its specific implementation process is:

[0022] Install the main board 1 on the main board fixing frame 3, and install a vibration damping element between the main board 1 and the main board fixing frame 3 to realize the primary vibration reduction of the main board 1. The material of the main board fixing frame 3 is a metal material, such as an aluminum plate or Stainless steel plate.

[0023] The motherboard fixing frame 3 is installed on the chassis, and a vibration damping element is installed between the motherboard fixing frame 3 and the chassis...

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Abstract

The invention discloses a composite vibration damping method for a ruggedized computer mainboard. The mainboard is installed on a mainboard fixing frame, a vibration damping element is installed between the mainboard and the mainboard fixing frame, and primary vibration damping of the mainboard is achieved; the mainboard fixing frame is installed on a case, a vibration damping element is installed between the mainboard fixing frame and the case, and secondary vibration damping of the mainboard is achieved; tension is applied between the mainboard and the mainboard fixing frame, when the mainboard gets closer to the mainboard fixing frame, the tension becomes larger, direct contact between the mainboard and the mainboard fixing frame is avoided, and tertiary vibration damping of the mainboard is achieved. Compared with the prior art, according to the composite vibration damping method for the ruggedized computer mainboard, the vibration and impact resistance of the ruggedized computer mainboard can be effectively improved, and therefore the reinforcing reliability of a whole computer is improved; the method has the advantages of being simple in structural design, small in occupied space, wide in application range, low in cost and the like, and is high in practicality and easy to popularize.

Description

technical field [0001] The invention relates to the technical field of computer vibration reduction, in particular to a composite vibration reduction method with strong practicability and reinforced computer mainboard. Background technique [0002] Ruggedized computers will be disturbed by various mechanical environments during transportation and use, including vibration, shock, swing, centrifugal acceleration, etc. Among them, vibration and shock have the greatest impact on equipment. The motherboard is the core component of the reinforced computer, and its adaptability to the vibration environment is poor. Especially in the random vibration environment, the requirements for its anti-vibration and shock performance are high, so it is necessary to take certain reinforcement measures to reduce the vibration and shock Damage to the motherboard and its components, thereby improving reliability and prolonging service life. [0003] At present, the anti-vibration and shock desig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
CPCG06F1/184
Inventor 夏峰孙永升陈乃阔张廷银张明
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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