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A Method of Pattern Correction Using Non-equidistant Trigger for Scanning of Direct-Writing Lithography Machine

A pattern correction and lithography technology, applied in the field of distance pattern correction, can solve the problems of the actual position deviation of the platform, inconsistent pattern splicing and misalignment, poor correction effect, etc., and achieve the effect of eliminating image errors and misalignment problems.

Active Publication Date: 2017-12-12
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The actual workpiece table will evaluate the Yaw, Pitch, and Roll values ​​during its movement. These three values ​​will cause the platform to deviate from the actual position during the movement. The most intuitive phenomenon brought about by image transfer is that each In each field and between fields, the graphics are spliced ​​from top to bottom, resulting in inconsistency and deformation.
The correction methods in the prior art all use the equidistant correction method, which not only has poor correction effect, but also cannot eliminate the inconsistency of splicing between the scanning fields of view caused by the movement error of the workpiece table

Method used

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  • A Method of Pattern Correction Using Non-equidistant Trigger for Scanning of Direct-Writing Lithography Machine
  • A Method of Pattern Correction Using Non-equidistant Trigger for Scanning of Direct-Writing Lithography Machine
  • A Method of Pattern Correction Using Non-equidistant Trigger for Scanning of Direct-Writing Lithography Machine

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Experimental program
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Embodiment 1

[0033] The specific process of graphic correction is as follows:

[0034] First, define N workpiece position trigger signals (PSO) as a Trigger signal, and the pattern generator will flip the pattern every time a Trigger signal is experienced. The larger the value of N is, the higher the accuracy of image line correction is, and the value of N in every two adjacent Trigger signals is different, that is, the value of the workpiece table position trigger signal of every two adjacent Trigger signals The number is different; the specific value needs to refer to the actual resolution capability of the workpiece table, such as figure 1 As shown, the value of N is 3, that is, one Trigger signal includes three workpiece stage position trigger signals (PSO).

[0035] The specific steps for calibration are:

[0036] Step 1: Use 3 trigger signals of the workpiece table position to trigger the pattern generator once, so that the pattern is flipped for the first time;

[0037] Step 2: R...

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Abstract

The invention provides a method for correcting graphs by non-equidistance triggering in scanning of a direct-writing type photoetching machine, and belongs to the technical field of graph correction. The method for non-equidistance graph correction includes calibrating the length of a Trigger through a plurality of workbench position triggering signals, dividing the whole graph scanning stroke into a plurality of correction sections, and finally, correcting images in the correction sections by defined content of four registers in the corresponding correction sections according to dislocation directions of the images, wherein four registers are defined in each correction section, and the starting point, the ending point, the correction gap and the correction direction of each correction section is defined by the corresponding register. The method has the advantages of high graph correction capability, good correction effect and the like.

Description

technical field [0001] The invention relates to a method for correcting images of non-equidistant scans by a direct-write photolithography machine, and belongs to the technical field of image correction. Background technique [0002] Direct writing lithography equipment, also known as direct image transfer equipment, is an important equipment in the field of semiconductor and PCB production that is different from traditional semi-automatic exposure equipment. It uses a pattern generator to replace the mask plate of the traditional lithography machine, so that the graphic data of the computer can be directly exposed to the wafer or PCB board, saving the time of board making and the cost of making the mask plate, and it can be used as a mask plate itself. . At present, in the projection process based on scanning technology, how to ensure that the graphics flip is kept in sync with the workpiece table carrying the wafer or PCB substrate is a relatively difficult problem. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/704G03F7/70433
Inventor 李显杰
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD