Method for correcting graphs by non-equidistance triggering in scanning of direct-writing type photoetching machine
A pattern correction and lithography technology, applied in the field of distance pattern correction, can solve the problems of the actual position deviation of the platform, inconsistent pattern splicing and misalignment, poor correction effect, etc., and achieve the effect of eliminating image errors and misalignment problems.
Active Publication Date: 2016-11-16
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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Problems solved by technology
The actual workpiece table will evaluate the Yaw, Pitch, and Roll values during its movement. These three values will cause the platform to deviate from the actual position during the movement. The most intuitive phenomenon brought about by image transfer is that each In each field and between fields, the graphics are spliced from top to bottom, resulting in inconsistency and deformation.
The correction methods in the prior art all use the equidistant correction method, which not only has poor correction effect, but also cannot eliminate the inconsistency of splicing between the scanning fields of view caused by the movement error of the workpiece table
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Embodiment 1
[0033] The specific process of graphic correction is as follows:
[0034] First, define N workpiece stage position trigger signals (PSO) as a Trigger signal, and the pattern generator will flip the pattern once every time a Trigger signal is experienced. The larger the value of N, the higher the accuracy of the graph line correction, and the value of N in each adjacent two Trigger signals is different, that is, the difference between the workpiece stage position trigger signal of each adjacent two Trigger signal clocks is The number is different; the specific value needs to refer to the actual resolution capability of the workpiece table, such as figure 1 As shown, the value of N is 3, that is, one Trigger signal includes 3 workpiece stage position trigger signals (PSO).
[0035] The specific steps for calibration are:
[0036] Step 1: Use 3 workpiece table position trigger signals to trigger a pattern generator to make the pattern flip for the first time;
[0037] The seco...
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The invention provides a method for correcting graphs by non-equidistance triggering in scanning of a direct-writing type photoetching machine, and belongs to the technical field of graph correction. The method for non-equidistance graph correction includes calibrating the length of a Trigger through a plurality of workbench position triggering signals, dividing the whole graph scanning stroke into a plurality of correction sections, and finally, correcting images in the correction sections by defined content of four registers in the corresponding correction sections according to dislocation directions of the images, wherein four registers are defined in each correction section, and the starting point, the ending point, the correction gap and the correction direction of each correction section is defined by the corresponding register. The method has the advantages of high graph correction capability, good correction effect and the like.
Description
technical field [0001] The invention relates to a method for correcting a non-equidistant pattern scanned by a direct-writing lithography machine, and belongs to the technical field of pattern correction. Background technique [0002] Direct-write lithography equipment, also known as image direct transfer equipment, is an important equipment in the field of semiconductor and PCB production that is different from traditional semi-automatic exposure equipment. It uses a pattern generator to replace the mask of the traditional lithography machine, so that the graphic data of the computer can be directly exposed to the wafer or PCB board, which saves the time and cost of making the mask, and can be used for the production of the mask itself. . At present, in the projection process based on scanning technology, it is a relatively difficult problem to ensure that the image flipping is synchronized with the workpiece stage that carries the wafer or PCB substrate. [0003] The two...
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IPC IPC(8): G03F7/20
CPCG03F7/704G03F7/70433
Inventor 陈海巍
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD