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Method and device for cutting thin film components

A technology of thin film components and cutting devices, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve problems such as lead wire burnout, achieve the effect of preventing adverse effects and improving product yield

Active Publication Date: 2018-12-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Carbide particles will remain between the lead wires in the electrode area, resulting in Short (short connection) between the lead wires and lead to Burning (burning out) of the lead wires

Method used

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  • Method and device for cutting thin film components
  • Method and device for cutting thin film components
  • Method and device for cutting thin film components

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Embodiment Construction

[0031] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0032] The present invention firstly provides a method for cutting a thin film assembly, the thin film assembly includes a first film layer, a second film layer and a third film layer stacked, wherein the second film layer is in an environment higher than a preset temperature can be carbonized, the method comprising:

[0033] Step 101: Using the first laser to partially cut the first film layer, the cutting depth is less than the thickness of the first film layer;

[0034] Step 102: Peel off the partially cut first film layer, so that the part to be cut of the second film layer is exposed;

[0035] Step 103: cutting the second film layer with a second laser, wherein the second laser is a laser for cutting in a non-ablation manner.

[0036] It can be se...

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PUM

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Abstract

The invention provides a method and device for cutting a thin film assembly. The thin film assembly comprises a first film layer, a second film layer and a third film layer which are arranged in a stacked manner, wherein the second film layer can be carbonized in the environment with the temperature higher than the set temperature. The method comprises the steps that a first laser is adopted for partially cutting the first film layer; the part, obtained through partial cutting, of the first film layer is stripped, and therefore a to-be-cut portion of the second film layer is exposed; and a second laser is adopted for cutting the second film layer, wherein the second laser is a laser carrying out cutting in a non-burn-melting manner. The device comprises a first cutter, a stripping mechanism, a second cutter and a controller. According to the method and device, the film layers can be prevented from being carbonized.

Description

technical field [0001] The invention relates to production and processing technology, in particular to a film component cutting method and device. Background technique [0002] In the flexible product cutting process, when cutting polyimide (PI) film and the film layer assembly composed of its upper and lower film layers, the laser source used is carbon dioxide laser combined with pulsed laser. [0003] The general cutting sequence is as follows: first, the upper PET (Polyethylene Terephthalate) layer is cut with a carbon dioxide laser; then, the protective film of the electrode edge area is peeled off. Or: first cut the upper PET layer by carbon dioxide laser, and then cut the PI layer and the lower PET layer by pulse laser. In the above process, when the upper PET is cut with a carbon dioxide laser, the carbon dioxide laser will cut off the PI layer by thermal melting, and the high temperature energy will react with the PI layer to produce carbide particles. Carbide part...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/57B23K26/60
CPCB23K26/38B23K26/57B23K26/60
Inventor 姜成才吴小平李楠
Owner BOE TECH GRP CO LTD