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Mounting locating tool based on double-layer manipulator and use method thereof

An installation and positioning, manipulator technology, applied in manufacturing tools, workpiece clamping devices, etc., can solve the problems of complicated leveling process, increased equipment maintenance time, time-consuming installation, leveling and film transfer testing, etc., to achieve reasonable structure, The effect of shortening the leveling time

Inactive Publication Date: 2016-11-23
PIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to improve the production capacity of the existing semiconductor coating equipment, most of them use double-layer manipulators to transfer and pick up the film. The leveling and film transfer tests are time-consuming, and the leveling process is more complicated, which greatly increases the overall maintenance time of the equipment

Method used

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  • Mounting locating tool based on double-layer manipulator and use method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment

[0011] Refer to attached figure 1 , based on the installation and positioning tooling of the double-layer manipulator, including the installation and positioning substrate 1, the positioning hole 6 for the front finger of the lower layer of the manipulator, and the positioning hole 7 for the front finger of the upper layer of the manipulator, wherein the installation and positioning base plate 1 is a symmetrical structure for positioning the front end of the upper and lower layers of the manipulator Finger, and the accuracy of the positioning hole 6 of the front end finger of the lower floor of the manipulator and the positioning hole 7 of the upper front end finger of the manipulator depend entirely on the guarantee of machining accuracy.

[0012] The specific installation method: first align and fix the positioning hole 7 of the upper front finger of the manipulator on which the positioning substrate 1 is installed and the mounting screw hole on the upper arm 4 of the manipul...

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PUM

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Abstract

The invention provides a mounting locating tool based on a double-layer manipulator and a use method thereof. The mounting locating tool not only can realize integrated operation of mounting and leveling front-end fingers of the double-layer manipulator but also reduces whole equipment maintenance time and reduces horizontal adjusting complexity. The mounting locating tool structurally comprises a mounting locating base plate, a locating hole for a lower-layer front-end finger of the manipulator and a locating hole for an upper-layer front-end finger of the manipulator, wherein the mounting locating base plate is of a symmetrical structure and is used for locating the upper and lower layers of front-end fingers of the manipulator, and the precision of the locating hole for the lower-layer front-end finger of the manipulator and the locating hole for the upper-layer front-end finger of the manipulator fully depends on machining precision. The structure is reasonable. The mounting and locating of the double-layer manipulator are realized by utilizing the symmetry of the mounting locating base plates and the locating hole structures, and after mounting, the levelness of the front-end fingers of the manipulator does not need to be adjusted, so that the horizontal adjusting time of the whole equipment is shortened. The tool is suitable for a double-arm structure having a left-right symmetrical double-layer manipulator and can be widely applied to the technical fields of the manufacture and application of semiconductor coating equipment.

Description

technical field [0001] The invention relates to a double-layer manipulator-based installation and positioning tooling and usage method in semiconductor coating equipment. The structure and usage method are mainly used in the installation and positioning process of the front-end fingers of a double-layer manipulator, and belong to the manufacturing and application technology of semiconductor coating equipment. field. Background technique [0002] In order to improve the production capacity of the existing semiconductor coating equipment, most of them use double-layer manipulators to transfer and pick up the film. The leveling and film transfer tests are time-consuming, and the leveling process is complicated, which greatly increases the overall maintenance time of the equipment. Contents of the invention [0003] In order to solve the above problems, the present invention designs a new type of installation and positioning tooling structure based on a double-layer manipulat...

Claims

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Application Information

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IPC IPC(8): B25B11/02
Inventor 廉杰方仕彩
Owner PIOTECH CO LTD
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