Bone conduction head hoop connecting device and forming technology

A technology of connecting device and molding process, applied in the field of smart wearable devices, can solve the problems of poor toughness, easy to break, heavy bone conduction device, etc., and achieve the effect of light weight

Inactive Publication Date: 2016-12-07
FUJIAN TAIER GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the object of the present invention is to provide a bone conduction headband connection device and molding process, which solves the problems of heavy weight, poor toughness and easy breakage of the bone conduction device in the prior art

Method used

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  • Bone conduction head hoop connecting device and forming technology
  • Bone conduction head hoop connecting device and forming technology
  • Bone conduction head hoop connecting device and forming technology

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Embodiment Construction

[0037] The present invention provides a bone conduction headband connecting device and molding process. In order to make the purpose, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0038] Please also see Figure 1-Figure 3 ,in figure 1 It is a structural schematic diagram of the bone conduction headband connection device of the present invention, figure 2 It is an exploded view of the bone conduction headband connection device of the present invention, image 3 It is a structural schematic diagram of the PA plastic buckle piece in the bone conduction headband connection device of the present invention. Such as Figure 1-Figure 3 As shown, the bone conduction headband ...

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Abstract

The invention discloses a bone conduction head hoop connecting device and a forming technology. The device comprises a silicone band and PA plastic clamping buckling pieces arranged at the two ends of the silicone band and integrally molded with the silicone band; treatment agent layers are arranged on the contact faces of the silicone band and the PA plastic clamping buckling pieces; each PA plastic clamping buckling piece comprises a clamping buckling piece body, a first fixed through hole formed in the left side of the upper half portion of the clamping buckling piece body, a second fixed through hole formed in the right side of the upper half portion, a first silicone fixed through hole formed in the left side of the lower half portion of the front face of the clamping buckling piece body and a second silicone fixed through hole formed in the right side of the lower half portion of the front face of the clamping buckling piece body. According to the bone conduction head hoop connecting device and the forming technology, due to integral molding of the silicone band and the PA plastic clamping buckling pieces, the weight is small, toughness is good, and the device is not prone to fracture.

Description

technical field [0001] The invention relates to the technical field of smart wearable devices, in particular to a bone conduction headband connection device and a molding process. Background technique [0002] With the development of science and technology and the continuous improvement of people's living standards, the use of various smart wearable devices is becoming more and more popular. However, the existing bone conduction devices are heavy, poor in toughness, and easy to break. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the deficiencies of the above-mentioned prior art, the object of the present invention is to provide a bone conduction headband connection device and a molding process, which solve the problems of heavy weight, poor toughness and easy breakage of the bone conduction device in the prior art. [0005] Technical scheme of the present invention is as follows: [0006] A bon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C69/02B29C45/00B29C43/18B29C35/00H04B1/3827
CPCB29C69/02B29C35/00B29C43/18B29C45/00B29C2043/189H04B1/3827
Inventor 罗令周大勇樊刚
Owner FUJIAN TAIER GRP CO LTD
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