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Curable resin composition, article, and method for fabricating the same

A technology for hardening resins and shaped products, which is applied in the field of hardened shaped products and hardenable resin compositions, and can solve the problems of low pyrolysis temperature, high curing temperature, inconvenient use, etc.

Inactive Publication Date: 2016-12-07
LEE CHANG YUNG CHEM IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional hardenable silicone resin composition has disadvantages such as high curing temperature and low thermal cracking temperature, making it inconvenient to use

Method used

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  • Curable resin composition, article, and method for fabricating the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0022] 100 parts by weight of IC 231 (a silicone resin with an alkoxy content of 0-20%, manufactured and sold by Wacker Chemie AG), 100 parts by weight of IC 836 (organic silicon resin, manufactured and sold by Wacker Chemie AG), and 33 parts by weight of KBM-13 (silane, manufactured and sold by Shin-Etsu Chemical Industry) were added to a reaction bottle and mixed uniformly to obtain siloxane resin LCY 2.

Embodiment 1

[0024] 2 parts by weight of tin (tin(II) 2-ethylhexanoate) (manufactured and sold by Alfa Aesar) and 1 part by weight of 2-ethyl-4-methylimidazole (2-ethyl-4 -methylimidazole) (the product number is EMI-24, manufactured and sold by T.C.I.) was added to a reaction bottle, and tetrahydrofuran (tetrahydrofuran, THF) was added as a solvent. Next, after fully stirring, 100 parts by weight of silicone resin LCY 2 was added into the reaction flask. After sufficient stirring, resin composition (I) was obtained. Forming the resin composition (I) into a coating and performing a heat treatment on the coating, wherein the process temperature of the heat treatment is 50°C. The coating formed from the resin composition (I) was completely cured within 3 hours to obtain a cured product. Next, the thermal decomposition temperature (thermal decomposition temperature, Td) of the hardened product was measured, and the results are shown in Table 1.

Embodiment 2

[0026] 1 part by weight of 2-ethylhexanoate tin (tin(II) 2-ethylhexanoate) (manufactured and sold by Alfa Aesar) and 1 part by weight of 2-ethyl-4-methylimidazole (2-ethyl-4 -methylimidazole) (product number is EMI-24, manufactured and sold by T.C.I) was added to a reaction bottle, and tetrahydrofuran (tetrahydrofuran, THF) was added as a solvent. Next, after fully stirring, 100 parts by weight of silicone resin LCY 2 was added into the reaction flask. After fully stirring, the resin composition (II) is obtained, the resin composition (II) is formed into a coating, and the coating is subjected to a heat treatment, wherein the heat treatment process temperature is 50°C. The coating layer formed from the resin composition (II) was completely cured within 3 hours to obtain a cured product. Next, the thermal decomposition temperature (thermal decomposition temperature, Td) of the hardened product was measured, and the results are shown in Table 1.

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Abstract

A curable resin composition, an article, and a method for fabricating the same are provided. The curable resin composition includes a siloxane resin and a catalyst. In particular, the catalyst includes an imidazole and an organic metal compound, and the organic metal compound includes an organic tin compound, organic zinc compound, organic nickel compound, organic cobalt compound, organic copper compound, or a combination thereof.

Description

technical field [0001] The present invention relates to a curable resin composition, a cured shaped product, and a method for producing the same, and more particularly relates to a curable silicone resin composition, a cured shaped product, and a method for manufacturing the same. Background technique [0002] Organic resins have gradually replaced inorganic glass as optical components (such as optical lenses, light-emitting diode packaging materials, etc.) due to their high machinability, light weight, low cost, and good impact resistance. In recent years, due to the development requirements of light-emitting diode technology, such as high brightness and high color, the packaging material of light-emitting diodes has gradually changed from epoxy resin to organosiloxane with better heat resistance, water resistance and transparency. resin. [0003] Organosiloxane resins, such as organopolysiloxanes, can be cured by alkylation with silicon hydride. The cured product formed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08J7/00
CPCC08G77/18C08K5/3445C08K5/57C08L83/04C09D183/04B29C39/003B29K2083/00B29L2011/0016
Inventor 蔡博年陈祐瑱汪若蕙
Owner LEE CHANG YUNG CHEM IND CORP
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