Separable substrate structure and preparation method therefor, and manufacturing method for display apparatus
A technology of substrate structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as the difficulty of separating flexible substrates from supporting substrates
Active Publication Date: 2016-12-07
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Problems solved by technology
[0004] Based on this, it is necessary to solve the problem that it is difficult to separate the flexible substrate from the supporting substrate in the traditional manufacturing method of the flexible substrate, and to provide a method for preparing a detachable substrate structure that is convenient for separating the flexible substrate from the supporting substrate.
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[0054] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.
[0055] See figure 1 , the preparation method of the detachable substrate structure of an embodiment, comprises the following steps:
[0056] S100, providing a supporting base 100.
[0057] Generally, a rigid substrate, such as a glass substrate, is used as the supporting base 100 .
[...
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The invention relates to a separable substrate structure and a preparation method therefor, and a manufacturing method for a display apparatus. The preparation method for the separable substrate structure comprises the following steps of providing a supporting base; forming a first release layer on the supporting base for protecting the supporting base; forming a second release layer with multiple first filling parts on the first release layer; filling the first filling parts with first magnetic particles to obtain the second release layer filled with the first magnetic particles; forming a third release layer on the second release layer which is filled with the magnetic particles; and forming a flexible base on the third release layer to obtain the separable substrate structure. According to the preparation method for the separable substrate structure, the first filling parts of the second release layer are filled with the magnetic particles, so that when a magnetic field is applied to the second release layer, the magnetic particles move relatively to loosen the second release layer, and consequently, the flexible base and the supporting base can be separated conveniently.
Description
technical field [0001] The invention relates to the field of display devices, in particular to a detachable substrate structure, a preparation method thereof, and a manufacturing method of a display device. Background technique [0002] In recent years, display devices with flexible substrates have broad application prospects in mobile or handheld display devices due to their bendable properties. Plastic substrates such as polyimide substrates, polyethersulfone substrates, etc., which are excellent in heat resistance and strength, are often used as flexible substrates. [0003] When manufacturing a display device using a flexible substrate, in order to ensure the flatness of the surface of the flexible substrate, a rigid substrate such as a glass substrate may be used as a supporting substrate to form the flexible substrate. A conventional manufacturing method of a flexible substrate is as follows: disposing a flexible substrate on a supporting substrate, then forming pixel...
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Login to View More IPC IPC(8): H01L27/12H01L21/77
CPCH01L21/77H01L27/12
Inventor 林昶
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD