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A ltcc/htcc automatic double-sided indentation equipment

A double-sided, indentation technology, applied in stone processing equipment, work accessories, manufacturing tools, etc., can solve labor problems and achieve high precision and high production efficiency

Active Publication Date: 2018-10-30
瓷金科技(河南)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem that the indentation needs to be carried out manually in the existing LTCC / HTCC processing process, the present invention proposes a LTCC / HTCC automatic double-sided indentation equipment, which is characterized in that it includes a frame, a feeding bin, a feeding Manipulator, indentation support, indentation mechanism, workbench, turning and unloading manipulator, unloading conveyor belt, control system, image positioning device; the frame is installed at the basic position of the present invention, and can support, install, Fix each functional part; the described feeding bin is installed on the frame, near the feeding manipulator and the workbench; the described feeding manipulator is installed on the frame, between the feeding bin and the workbench, its hand The working position of the claw should be located above the upper bin or workbench; the indentation support is installed on the frame, which can support and control the movement of the indentation mechanism; the indentation mechanism is installed on the indentation support It can move up and down on the indentation support; the workbench is installed on the frame, and there is a movable carrier on the workbench, and the movable carrier can move linearly and rotate around its own axis on the workbench; the movable carrier The loading position is located at one end of the loading manipulator, and the indentation position of the movable carrier is located under the indentation mechanism; the flipping and unloading manipulator is installed on the frame, and the working position of its claws is located on the movable carrier and the lower part of the workbench. above the material conveyor belt; the said unloading conveyor belt is installed on the frame, located under the turning and unloading manipulator, and can transport the processed ceramic substrate to the next process or storage position under the action of power; The control system described above is installed on the frame and connected with the power and moving components, including a control box, a controller, and a display screen; it is transported to the control box and installed on the frame; the controller is installed in the control box and connected to the display screen connected with each functional component; the display screen is installed on the panel of the control box, which is a touch screen, connected with the controller, and the operating parameters of each functional component can be set or modified through the display screen; the image positioning device is installed on the machine Rack, above workbench

Method used

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  • A ltcc/htcc automatic double-sided indentation equipment
  • A ltcc/htcc automatic double-sided indentation equipment
  • A ltcc/htcc automatic double-sided indentation equipment

Examples

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Embodiment Construction

[0038] In order to further illustrate the technical scheme of the present invention, the specific implementation manner of the present invention is illustrated in conjunction with accompanying drawing now; figure 1 In this example, a double-layer ceramic substrate is used as an example. The board A is a rectangle with a width of 130 mm and a length of 150 mm. The four corners are provided with gaps with a length of 10 mm and a width of 10 mm. The sides are parallel; the vertical distance of indentation B is selected to be 3.5 mm, and the horizontal distance of 5 mm is concentrated in the middle of the plate body A; three positioning holes C evenly distributed on a straight line are selected on each of the longitudinal sides, and the diameter of the positioning hole C is selected. Be 5 millimeters, ensure that the relative position between the positioning hole C and the indentation B is accurate; On this basis, select the specification and size of each part of the present invent...

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Abstract

The invention belongs to the field of electronic element production equipment, and relates to automatic double-face impressing equipment of LTCC / HTCC. A carrier base comprises guide blocks, linear bearings, an upper flat plate and a stepping motor mounting hole. The guide blocks are arranged on the lower portion of the upper flat plate. The two guide blocks are symmetrically distributed on the two sides of the lower portion of the upper flat plate. Each guide block is provided with a guide hole, and the two guide holes are parallel to each other and are located in the same plane parallel to the upper plane of the upper flat plate. The linear bearings are mounted in the guide holes. The four linear bearings are mounted at the two ends of the two guide holes. The linear bearings are matched with guide rails from inner holes. The upper flat plate is arranged on the upper portions of the guide blocks, the lower surface of the upper flat plate is connected with the guide blocks, and the upper surface of the upper flat plate is connected with a carrier. The stepping motor mounting hole is formed in the middle of the upper flat plate and is coaxial with the axis of a stepping motor on the carrier. The automatic double-face impressing equipment has the beneficial effects of be capable of automatically achieving double-face impressing of a multi-layer ceramic substrate and high in precision and production efficiency.

Description

technical field [0001] The invention belongs to the field of electronic component production equipment, in particular to an LTCC / HTCC automatic double-sided indentation equipment. Background technique [0002] With the advent of the integration era of various electronic devices, electronic machines have put forward higher requirements for circuit miniaturization, high density, multi-functionality, high reliability, high speed and high power, because co-fired multilayer ceramic substrates It can meet many requirements of the electronic machine for the circuit, so it has been widely used in recent years. Co-fired multi-layer ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic (HTCC) substrates and low-temperature co-fired multi-layer ceramic (LTCC) substrates, which are made of low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. Laser drilling, microporous grouting, precision conductor paste pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/22B28D7/04B28D7/00
CPCB28D1/222B28D1/225B28D7/00B28D7/005B28D7/04
Inventor 解华林刘永良赵书华毛福堂
Owner 瓷金科技(河南)有限公司