A ltcc/htcc automatic double-sided indentation equipment

Abstract

The invention discloses an LTCC (low temperature co-fired ceramic) / HTCC (high temperature co-fired ceramic) automatic double-surface indentation device, and belongs to the field of electronic element production devices. A carrier plate comprises a positioning block, a flat plate, a left inclined guide groove, a right inclined guide groove, a flat guide groove and a rotating component, wherein the positioning block is arranged at one corner of the flat plate, the flat plate is arranged on the lower portion of the positioning block, the left inclined guide groove is formed in the flat plate and positioned above the positioning block, the right inclined guide groove is arranged on the flat plate and positioned on the right upper side of the positioning block symmetric to the left inclined guide groove, the flat guide groove is formed in the flat plate, and the rotating component is mounted at the bottom of the flat plate. A rotating shaft is fixed to the center of the lower surface of the flat plate, the upper end of the rotating shaft is fixedly connected with the flat plate, the lower end of the rotating shaft is connected with a stepping motor shaft, a thrust bearing is mounted on the rotating shaft, and the upper surface and the lower surface of the thrust bearing contact with the flat plate and the upper surface of a carrier base respectively. The LTCC / HTCC automatic double-surface indentation device has the advantages of high precision and production efficiency and capability of automatically realizing double-surface indentation of a multilayer ceramic substrate.

Description

technical field [0001] The invention belongs to the field of electronic component production equipment, in particular to an LTCC / HTCC automatic double-sided indentation equipment. Background technique [0002] With the advent of the integration era of various electronic devices, electronic machines have put forward higher requirements for circuit miniaturization, high density, multi-functionality, high reliability, high speed and high power, because co-fired multilayer ceramic substrates It can meet many requirements of the electronic machine for the circuit, so it has been widely used in recent years. Co-fired multi-layer ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic (HTCC) substrates and low-temperature co-fired multi-layer ceramic (LTCC) substrates, which are made of low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. Laser drilling, microporous grouting, precision conductor paste pr...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem that the indentation needs to be carried out manually in the existing LTCC / HTCC processing process, the present invention proposes a LTCC / HTCC automatic double-sided indentation equipment, which is characterized in that it includes a frame, a feeding bin, a feeding Manipulator, indentation support, indentation mechanism, workbench, turning and unloading manipulator, unloading conveyor belt, control system, image positioning device; the frame is installed at the basic position of the present invention, and can support, install, Fix each functional part; the described feeding bin is installed on the frame, near the feeding manipulator and the workbench; the described feeding manipulator is installed on the frame, between the feeding bin and the workbench, its hand The working position of the claw should be located above the upper bin or workbench; the indentation support is installed on the frame to support and control the movement of the indentation mechanism; It can move up and down on the indentation support; the workbench is installed on the frame, and there is a movable carrier on the workbench, and the movable carrier can move linearly and rotate around its own axis on the workbench; the movable carrier The loading position is located at one end of the loading manipulator, and the indentation position of the movable carrier is located under the indentation mechanism; the flipping and unloading manipulator is installed on the frame, and the working position of its claws is located on the movable carrier and the lower part of the workbench. Above the material conveyor belt; the said unloading conveyor belt is installed on the frame, located below the unloading manipulator, and can transport the processed ceramic substrate to the next process or storage position under the action of power; the said The control system is installed on the frame and connected with the power and motion components, including the control box, controller, and display screen; it is transported to the control box and installed on the frame; the controller is installed in the control box to communicate with the display screen and each The functional components are connected; the display screen is installed on the panel of the control box, which is a touch screen and connected to the controller, and the operating parameters of each functional component can be set or modified through the display screen; the image positioning device is installed on the frame , located above the workbench

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