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A lead frame squeegee and its working process

A technology of lead frame and squeegee machine, which is applied in the direction of coating and coating liquid on the surface, etc. It can solve the problems of difficult to guarantee the quality of solder paste, unqualified products, and low work efficiency, so as to improve the quality of coating High efficiency, high pass rate of painting, and high painting efficiency

Active Publication Date: 2018-08-21
SHANDONG CAIJU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lead frame has higher requirements on solder paste, too much or too little solder paste will easily lead to unqualified products
At present, the work of brushing solder paste on the lead frame has not yet realized automated production. Operators are required to apply solder paste to each contact on the lead frame. Small, so it is difficult to guarantee the quality of solder paste, and the work efficiency is extremely low

Method used

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  • A lead frame squeegee and its working process
  • A lead frame squeegee and its working process
  • A lead frame squeegee and its working process

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Embodiment Construction

[0039] Figure 1~11 It is the best embodiment of the present invention, below in conjunction with attached Figure 1~11 The present invention will be further described.

[0040] A lead frame scraper machine, comprising a scraper mechanism 5, a stacking mechanism 8 and a control device, the lower side of the scraper mechanism 5 is provided with a lead frame conveying mechanism for conveying the lead frame, and the stacking mechanism 8 is provided with a lead frame conveying mechanism On one side of the lead frame, the lead frame conveying mechanism, the glue scraping mechanism 5 and the stacking mechanism 8 are all connected to the control device, the lead frame conveying mechanism is used to convey the lead frame, and cooperates with the glue scraping mechanism 5 to coat the Apply solder paste, and the stacking mechanism 8 is used to stack the lead frame on the stacking frame 21 . The lead frame conveying mechanism of the lead frame scraping machine cooperates with the scrap...

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Abstract

The invention provides a solder-paste spreading machine for lead frames and a working process of the solder-paste spreading machine, and belongs to the technical field of automation equipment. The solder-paste spreading machine is characterized by comprising a solder-paste spreading mechanism (5), a stacking mechanism (8) and a control device, wherein a lead frame conveying mechanism used for conveying lead frames is arranged on the lower side of the solder-paste spreading mechanism (5); the stacking mechanism (8) is arranged on the side, where the lead frames are conveyed, of the lead frame conveying mechanism; the lead frame conveying mechanism, the solder-paste spreading mechanism (5) and the stacking mechanism (8) are all connected with the control device; the lead frame conveying mechanism is used for conveying the lead frames, and cooperates with the solder-paste spreading mechanism (5) to spread solder-paste on the lead frames; and the stacking mechanism (8) is used for stacking the solder-paste-spread lead frames on a stacking shelf (21). By adoption of the solder-paste spreading machine, automation of solder-paste spreading is achieved, thereby greatly improving the spreading efficiency and the spreading quality; according to a working process of the solder-paste spreading machine, the solder-paste is spread on the lead frames when the lead frames are conveyed, so that the working efficiency is high; furthermore, the solder-paste-spread lead frames can be stacked, thereby facilitating the follow-up transfer of the solder-paste-spread lead frames; and the technology is simple.

Description

technical field [0001] A lead frame scraper and its working process belong to the technical field of automation equipment. Background technique [0002] During the manufacture of diodes or bridges, it is necessary to brush solder paste on the lead frame to facilitate the installation of chips on the lead frame, or to facilitate the bonding of two lead frames. Lead frames have higher requirements on solder paste, too much or too little solder paste will easily lead to unqualified products. At present, the work of brushing solder paste on the lead frame has not yet realized automated production. Operators are required to apply solder paste to each contact on the lead frame. Small, so it is difficult to guarantee the quality of solder paste, and the work efficiency is extremely low. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art, and provide a lead frame scraper and its working ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C1/16B05C13/02
CPCB05C1/16B05C13/02
Inventor 李向东
Owner SHANDONG CAIJU ELECTRONICS TECH CO LTD
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