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cutting device

A technology for cutting devices and cutting knives, which is applied to fine working devices, manufacturing tools, stone processing equipment, etc., and can solve the problem of vertical cracks only partially extending

Active Publication Date: 2020-09-08
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a scribe line is formed, there may be a case where the vertical crack extends completely in the thickness direction and the substrate is divided, but there is also a case where the vertical crack extends only partially in the thickness direction.

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0030]

[0031] figure 1 and figure 2 It is a figure which shows the main part of the cutting apparatus 100 which concerns on embodiment of this invention. The cutting device 100 includes: a platform 1 for placing the substrate W in a horizontal posture; a cutting blade 2 for breaking the substrate W by pressing against the substrate W; and a chuck 3 for fixing the substrate W placed on the platform 1 substrate. The cutting device 100 is a device that cuts a substrate W on which a scribe line SL has been formed in advance using a cutting blade 2 to extend a crack (vertical crack) from the scribe line SL in the thickness direction of the substrate W, thereby cutting the substrate W. Break along the scribe line SL.

[0032] The substrate W includes brittle materials such as glass substrates, ceramic substrates, and semiconductor substrates. The thickness and size are not particularly limited, but typically, a thickness of about 0.4 mm to 1.0 mm or a size of about 50 mm to...

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PUM

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Abstract

The present invention provides a cutting device capable of quickly and reliably detecting whether or not a substrate has been successfully cut through a cutting process. The present invention is an apparatus for cutting a substrate along a scribe line. The substrate is placed on a platform in such a manner that the direction in which the scribe line extends coincides with the direction in which the edge of the cutting blade extends, and the cutting blade is lowered to a predetermined level. Lower the stop position, thereby dividing the substrate, and the imaging device can repeatedly photograph the substrate when the cutting knife starts to descend, and the separation detection device will check whether the judgment index value generated based on the acquired image exceeds the specified value each time the captured image is captured. Threshold to determine whether the break is successful.

Description

technical field [0001] The invention relates to a cutting device for cutting a substrate, in particular to a detection of the cutting of a substrate in the cutting device. Background technique [0002] Generally, the manufacturing process of a flat panel display panel or a solar cell panel includes a step of breaking a substrate (mother substrate) containing a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. The splitting method is widely used in which a scribe line is formed on the surface of the substrate using a scribe tool such as a diamond point or a cutter wheel, and a crack (vertical crack) extends from the scribe line in the thickness direction of the substrate. When scribe lines are formed, there are cases where the vertical cracks completely extend in the thickness direction and the substrate is divided, but there are also cases where the vertical cracks extend only partially in the thickness direction. In the latter c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/0058B28D5/045
Inventor 时本育往吉田圭吾
Owner MITSUBOSHI DIAMOND IND CO LTD