A method for improving the accuracy of back-drilling stubs and a PCB using the method
A back-drilling and precision technology, applied in the directions of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of poor back-drilling STUB precision, and achieve the effect of improving the precision capability.
Active Publication Date: 2019-03-05
DONGGUAN SHENGYI ELECTRONICS
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Problems solved by technology
[0005] The purpose of the present invention is to propose a method for improving the accuracy of back-drilling stubs, which can solve the problem of poor precision of existing back-drilling stubs
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[0034] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0035] Back-drilling refers to using a drill with a diameter larger than that of a drilled hole to drill excess copper from the reverse side of a drilled metallized through hole to achieve the connection of the specified layer. Back-drilled STUB refers to the length of back-drilled non-metallized hole wall bottom to the adjacent non-drilled hole copper.
[0036] refer to figure 1 , in this embodiment, a method for improving the accuracy of back drilling STUB is provided, which includes the following steps:
[0037] Step A: Analyze the internal copper layer structure of the PCB and the glue flow law of the laminated laminate prepreg;
[0038] Step B: according to the analysis results in step A, establish a back drilling plate model;
[0039] Step C: Establish the contour surface map of the differe...
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The invention provides a method for improving accuracy of a backdrill STUB. The method comprises the steps of analyzing a glue flowing rule of an internal copper layer structure and a lamination plate prepreg of a PCB (Printed Circuit Board); building a backdrill plate model according to an analysis result; building equal-height curved surface diagrams of different copper contents of the backdrill plate model at each position of a panel and a plate thickness contour map at different positions; determining the thickness and the distribution of each internal copper layer of the plate needing to be backdrilled, partitioning the plate needing to be backdrilled into a plurality of regions, determining the accumulative thickness of the copper layers of each region and the distribution region of flowing glue according to the equal-height curved surface diagrams and the contour map, and performing divisionto obtain a plurality of sampling positions; and punching backdrill holes in the plate needing to backdrilled according to predicted plate thickness, cutting and sampling at the sampling positions, measuring the depth of an actual backdrill hole, and finally, adjusting the punching depth of the backdrill hole according to the need. Meanwhile, the invention also provides a PCB adopting the abovementioned method to arrange a backdrill hole. By adoption of the abovementioned method, the accuracy of the backdrill STUB can be improved.
Description
technical field [0001] The invention relates to the technical field of PCBs, in particular to a method for improving the accuracy of back-drilling stubs and a PCB using the method. Background technique [0002] At present, the back-drilling stub precision control in the industry is still a common technical problem. The stub precision control mainly depends on the precision improvement of drilling equipment and the control of plate thickness uniformity. There is no systematic analysis, judgment and control method. For example, a Chinese patent application discloses a back drilling method for PCB, which specifically includes the following steps: step 1, providing a PCB substrate; step 2, drilling through holes on the PCB substrate, step 3, plating copper on the entire board, The copper thickness in the hole is 2μm-15μm; step 4, the whole board is tinned; step 5, drill part of the copper on the through hole that needs to be back-drilled to form a back-drilled hole; step 6, ultr...
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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/0214
Inventor 何平张志远朱多丰
Owner DONGGUAN SHENGYI ELECTRONICS