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Wafer clamping device

A clamping device and wafer technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as abrasion of the wafer surface, and achieve the effect of improving quality and avoiding wear

Inactive Publication Date: 2017-01-18
HWATSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the entire clamping process, the wafer surface will produce sliding friction with the step surface of the stationary end, which will wear the wafer surface

Method used

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  • Wafer clamping device
  • Wafer clamping device

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Embodiment Construction

[0026] Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0027] The wafer holding device 100 according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings. process in between.

[0028] The wafer clamping device 100 according to the embodiment of the present invention may include: a first clamping part 10 , a second clamping part 20 and a driving part 30 . Such as figure 1 As shown, the first clamping member 10 has a first clamping end 11 and a first movable end 12, the second clamping member 20 has a second clamping end 21 and a second movable end 22, and the driving member 30 is set to synchronously drive The first movable end 12 and the second mov...

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Abstract

The invention discloses a wafer clamping device which comprises a first clamping piece which has a first clamping end and a first movable end, a second clamping piece which has a second clamping end and a second movable end, and a driving piece which is arranged to synchronously drive the first movable and the second movable end to move in a same direction or different directions, wherein the first clamping end and the second clamping end are oppositely arranged to clamp a wafer. Through arranging the first clamping piece and the second clamping piece, the two clamping end can synchronously move to clamp the wafer, thus the contact between the wafer and other surfaces can be avoided, the wear of the surface of the wafer can be avoided, and the quality of the wafer can be improved.

Description

technical field [0001] The invention relates to the technical field of wafers, in particular to a wafer clamping device. Background technique [0002] In the related art, the wafer clamping device is mostly a device whose one end is rigidly fixed, and the other end is driven by a cylinder or the like to clamp the wafer. When clamping the wafer, one side of the wafer is placed on the step of the stationary end, and the clamping action of the movable end makes the wafer slide to contact with the stationary end, thereby clamping the wafer through the joint action of the movable end and the stationary end. However, during the entire clamping process, the surface of the wafer will produce sliding friction with the step surface of the stationary end, which will wear the surface of the wafer. Contents of the invention [0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, the present invention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
CPCH01L21/687H01L2221/683
Inventor 王剑许振杰王同庆李昆路新春
Owner HWATSING TECH