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Device and method for cutting silicon ingot

A technology for silicon ingots and cutting steel wires, applied in the field of photovoltaic silicon wafer production, can solve problems such as mutual adhesion

Active Publication Date: 2017-12-15
JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a device and method for cutting silicon ingots, which are used to solve the problem of mutual adhesion of silicon wafers during the cutting process in the prior art. The method and device for cutting silicon ingots provided by the present invention can Keeps silicon wafers separate from each other during dicing

Method used

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  • Device and method for cutting silicon ingot
  • Device and method for cutting silicon ingot
  • Device and method for cutting silicon ingot

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] A method for cutting a silicon ingot, comprising the steps of:

[0088] (1) use Figure 2-Figure 4 The shown device for cutting silicon ingots adopts a multi-wire cutting machine (Donggang Company, model VWS), and a mortar tank 3 is arranged between two guide wheels 1 with cutting steel wires 2, so that the upper edge of the mortar tank The distance between the steel wire and the cutting wire is 30mm; connect the silicon ingot 4 (156×156mm) to be cut under the lifting table, and fix a top opening with a length of 200-250mm on the lifting table loaded with silicon ingots Rod 7 (specifically a round steel rod), mortar nozzles 5 are set on both sides of the lifting table so that it sprays mortar towards the cutting steel wire 2, and the silicon ingot is driven from the top to the top of the lifting table During the downward movement, the silicon ingot 4 is sliced ​​using the cutting steel wire 2; wherein, the device for cutting the silicon ingot is started to make the gui...

Embodiment 2

[0095] A device for cutting silicon ingots, the device includes a multi-wire cutting machine (Switzerland HCT company, model MB5), wherein the multi-wire cutting machine includes two guide wheels 1, the cutting steel arranged on the two guide wheels 1 Line 2 and the mortar tank 3 between the two guide wheels, wherein the distance between the upper edge of the mortar tank 3 and the cutting steel wire is 40-45mm;

[0096] The silicon ingot 4 (156×156mm) to be cut is connected under the lifting table of the multi-wire cutting machine, and a jacking rod 7 with a length of 150-200mm is fixed on the lifting table loaded with silicon ingots. The lifting table Mortar nozzles 5 are arranged on both sides to spray mortar toward the cutting steel wire 2, and the cutting steel wire 2 is used to The silicon ingot 4 is sliced;

[0097] Among them, the size of the mortar tank 3 is 583mm×376mm×103mm, the upper end of the tank body is open, and the bottom of the tank body is provided with squ...

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PUM

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Abstract

The invention provides a device for cutting a silicon ingot. The device comprises a lifting workbench and a mortar tank which is arranged between two guide wheels with cutting steel wires; to-be-cut silicon ingots are connected below the lifting workbench; mortar spray nozzles which spray mortar towards the cutting steel wires are arranged at the two sides of the lifting workbench; the mortar tank comprises a tank body which is in open in the upper end, and sand leaking holes are formed in the bottom of the tank body; the mortar tank is used for enabling the cut silicon ingot part or all of the silicon ingots to soak into mortar in the mortar tank when the cutting height of the silicon ingots reaches first height; a quick evacuating part is further arranged on the side wall of the mortar tank; and the quick evacuating part is used for evacuating mortar in the mortar tank when the cutting height of the silicon ingots reaches second height, wherein the first height is smaller than or equal to 0.6-0.7 time the height of the to-be-cut silicon ingots; and the second height is close to a joint of the silicon ingots and the lifting workbench. The device can be adopted to avoid adhering silicon slices in a cutting process, so that the yield of the silicon slices is increased. The invention further provides a method for cutting the silicon ingot.

Description

technical field [0001] The invention relates to the technical field of photovoltaic silicon wafer production, in particular to a device and method for cutting silicon ingots. Background technique [0002] The solar photovoltaic industry is an emerging green energy industry, and high quality and low cost are the key to the development of the photovoltaic industry. For photovoltaic cells based on silicon wafers, silicon wafers are the most expensive part of crystalline silicon photovoltaic cell technology, so reducing the manufacturing cost of silicon wafers is crucial to improving the competitiveness of solar energy. Silicon wafer slicing is a key process in the silicon wafer processing process, and its processing efficiency and processing quality are directly related to the overall situation of the entire silicon wafer production. [0003] At present, multi-wire cutting is generally used in the processing of silicon wafers. It uses cutting steel wires moving at high speed o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04
CPCB28D5/04B28D5/045
Inventor 刘华章金兵范立峰胡动力况云辉高建庭张细根黄亮亮宋绍林
Owner JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD