In-situ turnover mechanism of chip
A flipping mechanism and chip technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of difficult to guarantee the positional relationship between the chip and the chip slot, affecting the packaging process, and difficult to guarantee the level of the chip, and achieving a compact structure. , to ensure the levelness, and to facilitate the effect of accurate packaging
Pending Publication Date: 2017-02-01
GUANGDONG CHUTIAN DRAGON SMART CARD
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Problems solved by technology
[0003] The flipping of the chip is achieved indirectly by bending the antenna. It is difficult to ensure the level of the flipped chip, and it is also difficult to guarantee the positional relationship between the flipped chip and the chip slot (the chip cannot be accurately aligned with the chip slot), thus affecting Subsequent packaging processing
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[0021] The present invention will be described in further detail below with reference to the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
[0022] see Figure 1-Figure 7 The chip in-situ flipping mechanism of this embodiment consists of an intermediate connecting seat 4, a flipping actuator disposed on the intermediate connecting seat 4 for flipping the chip 9, and a flipping actuator for driving the intermediate connecting seat 4 to approach or leave the chip 9 to be flipped. of linear drive mechanism. Wherein: the turning actuator comprises a vacuum suction head 1, a swing rod 2 and a telescopic cylinder 3, wherein the vacuum suction head 1 is connected with a negative pressure device. The cylinder body 3-1 of the telescopic cylinder 3 is connected with the intermediate connecting seat 4 through the first rotating structure 6, and the telescopic rod 3-2 of the telescopic cylinder 3 is connected with one end...
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The invention discloses an in-situ turnover mechanism of a chip. The in-situ turnover mechanism comprises an intermediate connection seat, a turnover execution mechanism and a linear driving mechanism, wherein turnover execution mechanism is arranged on the intermediate connection seat and is used for turning over the chip, the linear driving mechanism is used for driving the intermediate connection seat to get close to or deviate from the chip to be turned over, the turnover execution mechanism comprises a vacuum suction nozzle, a swinging rod and a telescopic cylinder, the vacuum suction nozzle is connected with a negative pressure device, a cylinder body of the telescopic cylinder is connected with the intermediate connection seat by a first rotation structure, a telescopic rod of the telescopic cylinder is connected with one end of the swinging rod by a second rotation structure, the other end of the swinging rod is connected with the vacuum suction nozzle, the middle part of the swinging rod is connected with the intermediate connection seat by a third rotation structure, and a rotation central axis of the third rotation structure is coincided with a geometric center of a suction surface of the vacuum suction nozzle. By the turnover mechanism, in-situ turnover of the chip can be achieved, the levelness of the chip after being turned over can be ensured, moreover, the chip can also be enabled to be accurately aligned to a chip groove, and subsequent package processing is facilitated.
Description
technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a chip turning mechanism. Background technique [0002] In the smart card production process, the chip needs to be packaged into the card. The packaging process of the chip includes slot milling, wire picking, butt welding, packaging, etc. The two antennas protruding from the chip slot of the card are in a vertical state during butt welding, and the chip to be welded is in an upright state and the antenna is butt welded. connected together; before subsequent encapsulation, it is necessary to flip the bumped chip in the erected state to a horizontal state so that the chip can be aligned with the chip groove, and then the chip can be packaged into the chip groove. The flipping of the above-mentioned chip is completed by a chip flipping mechanism. The existing chip flipping mechanism is mainly composed of a group of relatively moving antenna bending mechanisms. The two antenna ...
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IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 苏晨蒋曲明彭浩毅孙宾华郭树超余燕雄陈平邬亮吴柏生黄展忠
Owner GUANGDONG CHUTIAN DRAGON SMART CARD