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Embedded circuit manufacturing method and packaging substrate

A circuit manufacturing and embedding technology, which is applied in the chemical/electrolytic method to remove conductive materials, manufacture circuits, semiconductors/solid devices, etc., to achieve the effects of easy monitoring and detection, avoiding voids or gaps, and easy infiltration

Active Publication Date: 2019-02-01
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Embodiments of the present invention provide a method for manufacturing an embedded circuit and a packaging substrate, which are used to solve the problems in the prior art caused by the embedded circuit being lower than the surface of the substrate

Method used

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  • Embedded circuit manufacturing method and packaging substrate
  • Embedded circuit manufacturing method and packaging substrate
  • Embedded circuit manufacturing method and packaging substrate

Examples

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Embodiment 1

[0028] Please refer to figure 1 , the embodiment of the present invention provides a buried circuit manufacturing method, the method is used for embedded circuit circuit board products with protruding circuit features, can be applied to high-density interconnected semiconductor packaging, and solves the problem of the same type of process The sag problem of the embedded circuit of the product. The method can include:

[0029] 101. A carrier board is provided, the carrier board includes an insulating base layer and a composite copper foil layer, and the composite copper foil layer includes two detachable ultra-thin copper foil layers.

[0030] Please refer to Figure 2a , the carrying board 20 described herein includes an insulating base layer 21 and a composite copper foil layer 22 disposed on at least one side surface of the insulating base layer. Specifically, the carrier board may be a copper clad board with a composite copper foil layer on its surface. Wherein, the ins...

Embodiment 2

[0080] Please refer to image 3 , the embodiment of the present invention provides a packaging substrate 40, which may include:

[0081] An insulating layer 27 , one side of the insulating layer 27 has a first circuit layer 26 , the first circuit layer is a buried circuit, and the top of the first circuit layer 26 is higher than the surface of the insulating layer 27 .

[0082] Optionally, the packaging base 40 may be a double-layer board. At this time, if image 3 As shown, the other side of the insulating layer 27 may have a second circuit layer 32, which is a non-embedded circuit, and the first circuit layer 26 and the second circuit layer 32 pass through the insulation The interlayer via structures of layer 27 are electrically connected.

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Abstract

The invention discloses a manufacturing method of an embedded line. The method comprises the steps as follows: a bearing plate is provided, wherein the bearing plate comprises an insulating base layer and a composite copper foil layer; the composite copper foil layer comprises two separable ultrathin copper foil layers; a line graph area of the composite copper foil layer is etched for a certain thickness; a non-copper metal protection layer is formed in the line graph area; a first line layer is formed in the line graph area by using an electroplating technology; sequential buildup is carried out on the first line layer, so that the first line layer becomes the embedded line; the composite copper foil layer is separated to obtain a packaging substrate; and the ultrathin copper foil layers are etched and removed and the non-copper metal protection layer is etched and removed to expose the first line layer. The embodiment of the invention further provides the corresponding packaging substrate. According to the technical scheme, the problem due to the fact that the embedded line is lower than the surface of a substrate in the prior art is solved.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 201610586453.6 and the title of the invention "Buried circuit manufacturing method and packaging substrate" submitted to the China Patent Office on July 22, 2016, the entire contents of which are incorporated herein by reference Applying. technical field [0002] The invention relates to the technical field of packaging substrate manufacturing, in particular to a method for manufacturing embedded circuits and a packaging substrate. Background technique [0003] In electronic device and system technologies, printed circuit boards (Printed Circuit Board, PCB) play an increasingly important role. With the trend of shrinking system volume, IC manufacturing process and packaging technology continue to develop towards finer and smaller connections and volumes. PCBs, which play a role in connecting devices and systems, are also developing towards high-density PCBs with miniatur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K1/18H01L23/14H01L21/48
Inventor 李飒谷新熊佳李小新
Owner SHENNAN CIRCUITS