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Heat-curable resin composition

A resin composition and thermosetting technology, which is applied in the field of thermosetting resin compositions, can solve problems such as cracking of cured products, and achieve the effect of excellent operability without compromising reliability

Inactive Publication Date: 2017-03-08
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when this resin composition is subjected to a pressure of a large temperature change such as a temperature cycle test, its cured product has conventionally cracked.

Method used

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Examples

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Effect test

preparation example Construction

[0090] The preparation method of thermosetting resin composition

[0091] The thermosetting resin composition of the present invention can be prepared, for example, by the method described below.

[0092] For example, (A) thermosetting resin and (B) liquid bismaleimide compound are mixed and stirred simultaneously or separately as needed while heat-treating, and then dissolved and / or dispersed to obtain (A) and (B) a mixture of components. At least one of an inorganic filler, a mold release agent, a flame retardant, and other additives of the (C) component of the ion trap may be added and mixed in the mixture of (A) and (B) components. Each component of (A)-(C) may be used individually by 1 type, and may use 2 or more types together.

[0093] The preparation method of the composition and the equipment for mixing, stirring and dispersing are not particularly limited. Specifically, for example, a crush mill, a two-roll mill, a three-roll mill, a ball mill, a planetary mixer o...

Embodiment

[0096] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to a following example.

[0097] About Examples 1-26 and Comparative Examples 1-15, each component shown below was mixed with the composition shown in Tables 1-3, and the thermosetting resin composition was prepared. This thermosetting resin composition was further molded under the conditions of 100° C.×2 hours and 150×4 hours to obtain respective cured products. In addition, in Tables 1-3, the quantity of (A)-(C) component is shown by mass parts.

[0098] (A) Thermosetting resin

[0099] (A1) Thermosetting resin components (epoxy resin and cyanate resin)

[0100] (A1-1) Bisphenol A epoxy resin (YD-8125: manufactured by Mitsubishi Chemical Corporation)

[0101] (A1-2) Aminophenol type trifunctional epoxy resin (jER 630: manufactured by Mitsubishi Chemical Corporation)

[0102] (A1-3) Bis-E type cyanate resin (LECy: manufac...

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Abstract

Provided is a heat-curable resin composition for use in electric and electronics industry which is suitable as an underfill and for performing potting, and is superior in fluidity, moisture resistance reliability and adhesiveness at a high temperature. The heat-curable resin composition of the invention contains (A) a heat-curable resin; and (B) a bismaleimide compound in liquid form at 25 DEG C, and exhibits a viscosity of 1 mPa*s to 850 Pa*s when measured at 25 DEG C in accordance with a method described in JIS Z8803:2011.

Description

technical field [0001] The present invention relates to a thermosetting resin composition comprising a thermosetting resin and a liquid bismaleimide compound. Background technique [0002] In recent years, the miniaturization of electronic devices such as mobile phones and smartphones, ultra-thin liquid crystal and plasma TVs, and lightweight notebook computers has been advancing. Electronic components used in these electronic devices are being integrated at a high density and further packaged at a high density. In addition, among the resin materials used for these electronic components, resin materials with low expansion force are sought for in relation to the time of manufacture and use. In addition, since high-integration electronic products generate heat, heat resistance is also sought after among resin materials. [0003] Conventionally, cyanate resins have been widely known as thermosetting resins having excellent internal heating properties, low dielectric constant,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08K5/3415C08K5/3417
CPCC08L63/00C08L79/04C08K5/3415C08K5/3417C08G73/12C08G59/42C08G73/124C08G73/128C08L79/085C08G59/5033C08G59/621C08L79/08C08L61/14C08K5/3445C08G59/506C08G18/3246C08L75/00C08G59/4238C08K5/09C08K5/18C08L63/04
Inventor 串原直行隅田和昌
Owner SHIN ETSU CHEM CO LTD
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