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A kind of probe preparation process

A preparation process and flexible circuit board technology, which is applied in the fields of printed circuit manufacturing, application, diagnostic recording/measurement, etc., can solve problems such as low reliability, failure to meet reliability and stability requirements, poor performance of circuit boards, etc., and achieve improved Production efficiency and yield, operability, and reliability improvement effects

Active Publication Date: 2019-01-15
SUZHOU ENGIN BIOLOGICAL MEDICAL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shortcoming of adopting above-mentioned structure to prepare probe is:
[0004] 1. Traditional circuit boards have relatively poor performance, low reliability and poor stability, and cannot meet the predetermined reliability and stability requirements;
[0005] 2. The pass rate of production probes is relatively low;
[0006] 3. The mass production efficiency of the probe is low

Method used

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  • A kind of probe preparation process
  • A kind of probe preparation process
  • A kind of probe preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0031] The first step of material preparation (composition):

[0032] Board-side rigid circuit board 1: 1, USB (3.0 Type-C) male 2: 1, flexible circuit board 3: 1, USB (3.0 Type-C) female 4: 1, line-side rigid circuit 5 board: 1, LED 7: 1, photosensitive tube 8: 2, medical double-sided adhesive 9: 1, medical foam tape 10: 1, board end sheath 11: 1, wire end protection Set of 12: 1 pc, Epoxy logo 14: 4 pcs.

[0033] All its components, such as medical foam tape 10, medical double-sided adhesive tape 9, flexible circuit board 3 and board end sheath 11, are directly processed and formed at one time, without subsequent processing, directly assembled, convenient and fast, and high production efficiency;

[0034] 2) Selection of materials: flexible circuit board 3, medical foam tape 10, medical double-sided adhesive 9 and other flexible materials are used, which not only improves the reliability and stability of the product, but also makes the product fit better It is not easy to ...

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Abstract

The invention discloses a probe preparation technology, comprising: welding a USB male joint with the front end of a board-side rigid circuit board; welding a flexible circuit board to the tail end of the board-side rigid circuit board; then welding in sequence a light emitting diode and two photosensitive tubes onto the upper surface of the flexible circuit board for a flexible circuit board component; taking out a medically applied double-sided adhesive tape which comprises an upper layer of wax paper, a middle layer of glue, and a lower layer of wax paper; cutting for the profile of the flexible circuit board on the upper layer of wax paper in advance; tearing off the profile of the flexible circuit board; adhering the prepared flexible circuit board component along the profile; removing the remaining upper layer of wax paper; taking out the medically applied foam tape which includes an upper layer of non-woven fabrics, a middle layer of medical foam, and a lower layer of wax paper; removing the lower layer of wax paper; aligning the foam tape and the profile of the medically applied double-sided adhesive tape along one side of a tool; pressing tight and fixing them; sleeving from the USB male joint the board-side protection sheath; and filling seal materials between the board-side rigid circuit board and the board-side protection sheath.

Description

technical field [0001] The invention belongs to the technical field of medical device preparation, and in particular relates to a probe preparation process. Background technique [0002] Near Infrared Spectroscopy (NIRS) is a physiological parameter detection technology that has gradually emerged in the past 20 years. Its core detection indicators are tissue oxygen saturation (TissueOxygenIndex, TOI) and tissue hemoglobin concentration index ( Tissue Hemoglobin Index, THI). The near-infrared tissue blood oxygen parameter non-destructive monitor (hereinafter referred to as the oximeter) injects light of three different wavelengths into the tissue under test, and obtains the absorption of light by the tissue by measuring the intensity of the outgoing light, and then undergoes a series of solutions. Finally, a series of tissue blood oxygen parameters such as the measured tissue oxygen saturation (TOI, %) and tissue hemoglobin concentration index (THI) are obtained. The oximet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K3/34H05K3/36A61B5/1455
CPCA61B5/14551H05K3/34H05K3/363H05K13/04
Inventor 王国山程永全刘玉亮李南
Owner SUZHOU ENGIN BIOLOGICAL MEDICAL ELECTRONICS
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