Exposure device and exposure method
A device and technology to be exposed, applied in microlithography exposure equipment, optomechanical equipment, photolithographic process exposure devices, etc., can solve the problem of mask sagging, inconsistent exposure gap between the mask and the substrate to be exposed, and affect the uniformity of exposure. It can achieve the effect of roughly the same distance, ensuring the uniformity of exposure, and the same exposure gap.
Inactive Publication Date: 2017-03-22
BOE TECH GRP CO LTD +1
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[0003] The invention provides an exposure device and an exposure method, which are used to solve the problem that the mask plate will sag under its own gravity, resulting in inconsistent exposure gaps between the mask plate and the substrate to be exposed, and affecting the uniformity of exposure.
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[0019] The specific implementation manner of the present invention will be further described in detail below with reference to the drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0020] combine figure 1 with figure 2 As shown, an exposure device is provided in an embodiment of the present invention, which includes a workbench and a fixing mechanism, and the workbench is used to place a substrate 3 to be exposed. The fixing mechanism is used to fix the mask plate 2 above the workbench. The workbench includes a flexible fixed plate 1 , the substrate 3 to be exposed is fixedly placed on the surface of the fixed plate 1 close to the mask plate 2 , and the entire substrate 3 is closely attached to the surface of the fixed plate 1 . The fixed plate 1 includes at least two evenly distributed adjustment points 10, through the adjustment points 10, the gap between the ...
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The invention relates to the field of thin film preparation and discloses an exposure device and an exposure method. The exposure device is used for fixing a to-be-exposed substrate through a flexible fixing plate, the whole substrate is tightly laminated with the fixing plate, and the fixing plate can drive the substrate thereon to consistently deform while deforming, so that adjustment of an exposure clearance between the substrate and a mask is converted into adjustment of a distance between the fixing plate and the mask. The distances between all adjustment points and the mask can be controlled to be consistent through driving at least two evenly distributed adjustment points on the fixing plate to move towards the direction close to the mask or far away from the mask, the roughly consistent distance between the whole fixing plate and the mask is achieved, that is to say, the exposure clearance between the whole substrate and the mask is consistent, and then the substrate is exposed by using the mask, so that the exposure uniformity is ensured and the quality of a product is improved.
Description
technical field [0001] The invention relates to the technical field of film preparation, in particular to an exposure device and an exposure method. Background technique [0002] The high-generation production line of display products is used to produce large-size products above 32 inches. The size of the mask used in the exposure process is relatively large. During the exposure process, the mask will sag under its own gravity, resulting in The exposure gap between the film plate and the substrate to be exposed is inconsistent, thus affecting the exposure uniformity. At present, the industry mostly adopts the method of forming a negative pressure on the upper part of the mask, so that the pressure on the lower part of the mask is higher than the pressure on the upper part of the mask, and the mask is supported by the pressure difference to reduce the sagging of the mask, thereby Improves the exposure uniformity effect, but the effect is not ideal. Contents of the inventio...
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IPC IPC(8): G03F7/20
CPCG03F7/70775G03F7/70783
Inventor 郭光龙
Owner BOE TECH GRP CO LTD