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A nanofluid cooling device

A technology of nanofluid and heat dissipation device, which is applied in the direction of cooling/ventilation/heating transformation, modification with liquid cooling, etc. It can solve the problems of lack of cooling device and technology, and achieve high heat dissipation effect

Active Publication Date: 2019-02-19
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, certain heat-generating components such as nuclear power plants can be connected to cold sources such as rivers for cooling, but there is still a lack of mature cooling devices and technologies under the working conditions of upper heating and lower cooling

Method used

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  • A nanofluid cooling device
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Embodiment 1

[0022] Such as figure 1 As shown, a nanofluid cooling device includes an outer wall 1 and an inner partition 2; the outer wall 1 seals the entire device into an outer wall cavity, and the inner partition 2 is axisymmetrically arranged on the central axis of the entire device. In the cavity of the outer wall, the inner partition 2 is not in contact with the outer wall 1, and the space between the outer wall 1 and the inner partition 2 is filled with a certain thickness of porous medium 3, and the inner partition 2 and the porous medium 3 form a hollow partition plate cavity; there is nanofluid on the porous medium 3; the filling density of the porous medium 3 gradually decreases from the upper end to the lower end of the outer wall cavity; the higher end of the porous medium 3 in the device is in line with the external needs The heat source part of the heat dissipation device is in contact.

[0023] In this embodiment, the porous medium 3 is made of metal particles, and the me...

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Abstract

The invention provides a heat dissipating device of a nanofluid. According to the device, when the nanofluid in a porous medium encounters an external heat source at the end with relatively high packing density of the porous medium to become gas due to occurrence of phase change, the gas is diffused in a partition board cavity, and the nanofluid is condensed into liquid when being diffused to the end with relatively low packing density of the porous medium. At the end of the heat source, due to the surface tension of the gas and the liquid, after hot liquid is vaporized, cold liquid in a nearby region is quickly driven to the end of the heat source, and the process of heat absorption, temperature rise and phase change is carried out continuously. The liquid inside the region of the porous medium is supplemented through gas liquefaction at the end with relatively low packing density, so that a heat dissipating cyclic process is formed.

Description

technical field [0001] The invention relates to the field of heat dissipation equipment, in particular to a nanofluid heat dissipation device. Background technique [0002] With the development of electronic devices, the demand for cooling technology also increases. Under the premise that there is not enough space for specific heating components to dissipate heat in the form of traditional natural convection, the technology of dissipating heat and cooling below the heat source is particularly important. For example, certain heat-generating parts such as nuclear power plants can be connected to cold sources such as rivers for cooling. However, there is still a lack of mature cooling devices and technologies under the working conditions of upper heating and lower cooling. Contents of the invention [0003] The invention provides a nanofluid heat dissipation device with high heat dissipation effect. [0004] In order to achieve the above-mentioned technical effect, the tech...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029
Inventor 朱庆勇庄依杰余怀忠郭松灿
Owner SUN YAT SEN UNIV