Touch device and manufacture method
A technology of a touch device and a manufacturing method, which is applied in the direction of instruments, electrical digital data processing, and input/output processes of data processing, etc., can solve the problems that short circuits or open circuits cannot be completely prevented, and the tensile strength of flexible circuit boards is not strong. Prevent water vapor corrosion, the effect of firm flexible circuit board
Inactive Publication Date: 2017-03-29
江西卓讯微电子有限公司
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Problems solved by technology
[0002] In the related art, the touchpad and the flexible circuit board of the touch device are generally conducted in the binding area through the conductive part, and the flexible circuit board will form a step in the binding area, resulting in the components of the touchpad and the flexible circuit board being connected to the cover later. When the boards are bonded, the bonding layer needs to be grooved to avoid the steps in the bonding area, so that there is a certain gap in the bonding area. Even if the bonding layer and encapsulant are used in addition, it cannot completely prevent water vapor from entering, causing corrosion of the circuit, and causing a short circuit or Open circuit, and the tensile strength of the flexible circuit board is not strong
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[0043] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
[0044] The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0045] In describing the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front ", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inside", "Outside", "Clockwise", "Counterclockwise", etc. The orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiment of the prese...
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The invention discloses a touch device, which comprises a touchpad, a cover board, a bonding layer and a flexible circuit board, wherein the cover board is arranged on the top the touchpad; the cover board is bonded with the touchpad through the bonding layer; the flexible circuit board is connected with a connection part; the connection art is arranged between the touchpad and the cover board and is connected to the touchpad; and the bonding layer carries out sealing bonding on the connection part. In addition, the invention also discloses a manufacture method. By use of the touch device and the manufacture method of the implementation way of the invention, since the bonding layer is adopted for carrying out the sealing bonding on the connection part, the bonding layer between the cover board and the touchpad does not need to be notched to avoid the connection part, the circuit of the touchpad can be prevented from being corroded by water vapor, in addition, the bonding area of the flexible circuit board and the cover board is larger, and therefore, the flexible circuit board is firmer and can resist larger tensile force.
Description
technical field [0001] The invention relates to the field of touch technology, in particular to a touch device and a manufacturing method. Background technique [0002] In the related art, the touchpad and the flexible circuit board of the touch device are generally conducted in the binding area through the conductive part, and the flexible circuit board will form a step in the binding area, resulting in the components of the touchpad and the flexible circuit board being connected to the cover later. When the boards are bonded, the bonding layer needs to be grooved to avoid the steps in the bonding area, so that there is a certain gap in the bonding area. Even if the bonding layer and encapsulant are used in addition, it cannot completely prevent water vapor from entering, causing corrosion of the circuit, and causing a short circuit or Open circuit, and the tensile strength of the flexible circuit board is not strong. Contents of the invention [0003] The present invent...
Claims
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IPC IPC(8): G06F3/041G06F3/044
CPCG06F3/041G06F3/044G06F2203/04102G06F2203/04103
Inventor 何祥波寨虎许建勇
Owner 江西卓讯微电子有限公司