A method of using dry film to bond glass microfluidic chips at room temperature
A microfluidic chip and dry film technology, which is applied to laboratory containers, chemical instruments and methods, laboratory utensils, etc., can solve problems such as high cost and difficult bonding of glass microfluidic chips, and achieve equipment The effect of less, low bonding cost, and short bonding time
Active Publication Date: 2018-10-23
BEIJING UNIV OF CHEM TECH
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] In order to achieve the above purpose, the technical solution adopted in the present invention is a method of bonding glass microfluidic chips using dry film at room temperature, which solves the problem of difficult and expensive bonding of glass microfluidic chips
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] Attached below Figure 1-4 And embodiment further illustrate the present invention.
[0025] (1) The material of the substrate 3 is a glass substrate containing a microchannel structure, and the material of the cover sheet 1 is glass;
[0026] (2) Peel off the lower protective layer of the dry film 2, and attach it flat on the cover sheet 1;
[0027] (3) Peel off the upper protective layer of the dry film 2, and attach it flat on the substrate 3. The stacking sequence of each layer of the microfluidic chip is cover sheet 1-dry film 2-substrate 3;
[0028] (4) Preliminarily press the prepared microfluidic chip using a plastic machine to remove air bubbles, and the temperature of the drum of the plastic machine is 90-120 °C;
[0029] (5) Place the microfluidic chip in a black box isolated from ultraviolet light and let it stand for 15 minutes;
[0030] (6) Send the microfluidic chip stacked in the order of cover sheet 1-dry film 2-substrate 3 into the UV exposure machi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for performing bonding of a glass microfluidic chip at a normal temperature by using a dry film, and belongs to the field of microfluidic chips. The method is used for performing bonding of the glass microfluidic chip under a normal temperature condition by using the dry film. The method comprises the following steps: laminating materials, namely a glass substrate comprising a microchannel structure, and a glass cover plate, together by virtue of a dry film to form a stacking order of the cover plate-the dry film-the substrate; then performing preliminary lamination and bubble removal on the stacked microfluidic chip by virtue of a laminator; then putting the microfluidic chip into a black phase isolated from ultraviolet light; and finally, delivering the microfluidic chip into an ultraviolet exposure machine to perform exposure. The method for performing bonding of the glass microfluidic chip, disclosed by the invention, is low in cost, low in equipment requirement, simple in operation process, high in finished product rate and high in bonding strength, and has wide applicability for various glass substrates of different materials and thicknesses; and a machining process is safe and nontoxic, has no high temperature and high pressure, avoids release of chemical harmful substances, and is short in bonding time.
Description
technical field [0001] The invention belongs to the field of microfluidic chips, and in particular relates to a method for bonding microfluidic chips made of glass. For large-scale microfluidic chip production and processing. Background technique [0002] It has been more than 20 years since the concept of microfluidic chips was proposed, and its miniaturization has brought good application prospects, so it has gradually become one of the most concerned directions in the fields of analytical chemistry and life sciences. [0003] The microfluidic chip integrates microfluidic technology on a platform of several square centimeters of glass or polymer, and integrates or Partially integrated to realize miniaturized centralized analysis of physical, chemical and biological experiments in routine laboratories. Driven by the development of micro-processing technology, the functions of microfluidic chips have gradually diversified, and their application fields have gradually expand...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707B01L2300/0887B01L2300/12B01L2300/16
Inventor 范一强王玫庄俭唐刚张亚军
Owner BEIJING UNIV OF CHEM TECH