Coating device, coating head and coating method
A coating device and coating technology, applied in the coating device, coating head and coating field, can solve the problems of inability to coat film-forming liquid, etc., reduce the occurrence rate of defective products, improve operability, and prevent dust Effect
Active Publication Date: 2019-05-10
ENATECH CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0019] However, the above-mentioned coating device is configured to apply the film-forming liquid 116 only to the end surface 130a of the printed circuit board 130, and there is a problem that the film-forming liquid cannot be thinly and uniformly coated in a frame shape on the peripheral edge portion including the end surface of the substrate.
Method used
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Embodiment Construction
[0094] Embodiments of a coating device, a coating head, and a coating method according to the present invention will be described below based on the drawings. 1 is a side view in which the frame is omitted to show the internal structure of the coating device according to the embodiment (1), figure 2 It is a front view in which the housing is omitted to show the internal structure of the coating device.
[0095] The coating apparatus 1 includes a support table 10 for supporting a substrate 2 , a coating unit 20 including a pair of coating heads 21 composed of an upper head 22 and a lower head 23 , and a moving unit 40 for moving the coating unit 20 . .
[0096] In addition, the coating device 1 is equipped with a liquid supply unit 50 for supplying a pair of coating heads 21 with a film-forming liquid 51 containing a resin component, a drying oven 60 for drying the film-forming liquid 51 coated on the substrate 2, The control part 70 and the operation part 80 which control t...
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A coating apparatus 1 with which it is possible to cause a film-forming liquid to be coated to a small, uniform film thickness on peripheral edge sections of a substrate that include the end faces, and with which it is possible to stably form a coating film with little variation in film thickness; wherein the apparatus is provided with: a support table 10 for supporting the substrate 2; a coating unit 20 provided with a pair of coating heads 21; a movement unit 40 for moving the coating unit 20; a liquid supply unit 50 for supplying the film-forming liquid 51 to the coating heads 21; and a control unit 70 for controlling the movement unit 40 so that the coating heads 21 are caused to move along the peripheral edge sections of the substrate 2 with the end section of the substrate 2 having been inserted into the gap between the coating heads 21, the application heads 21 being equipped with liquid-storage sections 22a, 23a for storing the film-forming liquid 51, and coating units 22c, 22d, 23c, 23d for applying, as a thin film, the film-forming liquid 51 that has adhered to the end section of the substrate 2 that has passed through the liquid-storage sections 22a, 23a.
Description
technical field [0001] The present invention relates to a coating device, a coating head and a coating method, and more particularly, to a coating device, a coating head and a coating method for coating a liquid on a peripheral edge of a substrate. Background technique [0002] Generally, printed circuit boards using glass epoxy resin components are used as substrates for mounting electronic components. Glass epoxy parts are formed by impregnating epoxy resin on overlapping glass cloth. As a result, fine dust consisting of epoxy resin or glass fibers is generated when cutting glass epoxy components. These fine dusts may cause problems such as poor contact of the substrate circuit or degradation of quality. Therefore, it is necessary to remove the dust generated when the substrate is cut when the printed substrate is manufactured. [0003] However, even if the dust is removed from the end surface of the printed circuit board, since the end surface portion of the printed ci...
Claims
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IPC IPC(8): H05K3/28B05D1/26B05D7/00
CPCB05D1/26B05D7/00H05K3/28B05C5/02B05C13/02B05C21/00
Inventor 松山隆勇吉塚秀人
Owner ENATECH CORP